Shenzhen Longsys Electronics Co., Ltd. Class H
142.80
HKD
-8.00
(-5.31%)
ISIN
CNE100007X96
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
CNY
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
CNY
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in mil. unless spec.Company Description
- CEO
- Hua Bo Cai
- Full Time Employees
- 4,040
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Room 2001, 2201, 2301, Tower B, Phase II, Hongrongyuan Qianhai Financial Center, 5059 Tinghai Avenue, Nanshan Street, Qianhai Shenzhen-Hong Kong Cooperation Zone Shenzhen GD China 518057
- IPO Date
- Aug 5, 2022
- Website
- longsys.com
- Similar Companies
- Business
- Shenzhen Longsys Electronics Co., Ltd. (Stock code: 301308.SZ) is a branded semiconductor storage enterprise that researches, designs, manufactures, and sells memory and storage solutions, including storage chips, main control chips, firmware algorithms, and related software and hardware applications, serving consumer electronics, automotive, industrial, and data-center segments; the company operates from its headquarters in Shenzhen, Guangdong Province, China, and pursues a global footprint with customers and partners across Asia, Europe, and the Americas. Main products and services: semiconductor memory solutions; storage chips design and fabrication; main control chips design; firmware and algorithm development; packaging and testing services; memory product assembly and integration; automotive-grade, industrial-grade, and consumer-grade memory products; software and hardware storage solutions; related hardware peripherals and development platforms; global distribution and after-sales support; research and development in memory technology and packaging innovations; licensing and technology collaboration agreements with OEMs and system integrators; import/export of electronic components and finished memory modules. Latest major company changes: forms and pursues strategic partnerships and alliances with memory ecosystem players to accelerate product diversification and market penetration; pursues geographic expansion through regional distribution agreements, joint development projects, and potential acquisitions or minority stakes to bolster memory technologies and packaging capabilities; launches and expands product lines including high-density DRAM and NAND-based storage solutions, automotive-grade storage modules, and embedded memory solutions for IoT and industrial applications; undergoes corporate reorganizations or name changes as it scales operations and optimizes corporate structure to support its international growth; enhances manufacturing capacity and supply chain resilience to serve customers in multiple regions. Industry context and segments: primary industry is memory and storage semiconductors; business segments include consumer electronics memory, automotive-grade memory, industrial memory, and enterprise/storage applications; target markets include smartphone OEMs, consumer electronics brands, automotive electronics suppliers, data-center and cloud infrastructure providers, IoT device manufacturers, and industrial automation companies; geographic operations span Mainland China and international markets, with distribution and customers worldwide; corporate structure includes potential subsidiaries and strategic affiliates as part of its growth strategy.