HUHUTECH International Group Inc.

HUHUTECH International Group Inc.

NNASDAQ:HUHU
1.69
USD
-0.30
(-15.08%)
243.45MMarket Cap
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.21
0.48
0.54
0.79
0.9
0.89
- -
Basic EPS, GAAP
0.05
0.07
0.04
0.11
-0.1
-0.72
- -
Free Cash Flow per Basic Share
-0.03
-0.03
-0.01
0.09
-0.34
0.11
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
0.05
0.14
0.17
0.27
0.31
0.31
0.31
Tangible Book Value per Share
0.05
0.13
0.16
0.27
0.3
0.31
0.31
Basic Weighted Avg Shares
21
21
21
21
20
24
24
Sales/Revenue/Turnover
4
10
11
17
18
21
- -
Operating Margin (%)
31.11
14.02
8.02
12.92
-8.58
-79.6
- -
Depreciation Expense
- -
- -
- -
- -
- -
- -
- -
Net Income, GAAP
1
1
1
2
-2
-17
- -
Effective Tax Rate (%)
22.9
15.58
3.56
9.87
- -
- -
- -
Profit Margin (%)
23.73
13.48
8.18
13.95
-10.64
-80.93
- -
Working Capital
- -
2
2
3
1
4
4
LT Debt
- -
- -
- -
- -
- -
2
2
Total Equity
1
3
4
6
7
7
7
Return on Invested Capital (%)
- -
50.3
18.2
28.36
- -
- -
- -
Return on Capital (%)
- -
50.66
19.22
34.46
- -
- -
- -
Return on Common Equity (%)
- -
71.27
29
50.01
-31.39
-248.84
- -

Capital Structure

USD

•

in mil. unless spec.
Dec'24
Jun'25
Dec'25
ST Debt
6
4
4
LT Borrowings
- -
2
2
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
21
23
24
Market Capitalization
100
113
243

Working Capital

USD

•

in mil. unless spec.
Dec'24
Jun'25
Dec'25
Total Current Assets
15
17
17
Cash, Cash Equivalents & STI
3
3
4
Accounts Receivable, Net
10
12
10
Inventories
1
1
1
Total Current Liabilities
13
13
13
Payables & Accruals
6
7
7
ST Debt
6
4
4
Deferred Revenue
1
2
2

Growth Rates

USD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
61.02%
13.63%
Free Cash Flow
- -
-310.15%
-139.78%
Net Income, GAAP
- -
152.56%
798.1%
Sales/Revenue/Turnover
- -
42.42%
18.09%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

USD

•

in mil. unless spec.

Year

H1
H2
FY
2023
- -
- -
17
2024
- -
- -
18
2025
- -
- -
21

Semi-annual Earnings Per Share

USD

•

in mil. unless spec.

Year

H1
H2
FY
2023
- -
- -
0.11
2024
- -
- -
-0.1
2025
- -
- -
-0.72

Semi-annual Dividends Per Share

USD

•

in mil. unless spec.

Year

H1
H2
FY
2023
- -
- -
- -
2024
- -
- -
- -
2025
- -
- -
- -

Company Description

CEO
Yu Jun Xiao
Full Time Employees
78
Sector
Technology services
Industry
Information technology services
Address
3-1208 Tiananzhihui Compound Wuxi City JS China 214135
IPO Date
Oct 23, 2024
Business
I did not find relevant or recent information about HUHUTECH International Group Inc. (Ticker: HUHU) in the initial web search focused on latest company changes or detailed corporate description. I will now perform a more focused search specifically on "HUHUTECH International Group Inc. business description and recent updates" and also check its official investor relations website for updated corporate details and recent major changes.

Company News

  • HUHUTECH Subsidiary Joins Consortium Bidding on Semiconductor Fab Gas Delivery System Project in China Valued at More Than RMB 60 Million

  • Semiconductor Infrastructure Provider HUHUTECH Secures US$1.12 Million in New Automation System Integration Orders in Germany

  • HUHUTECH Provides Commercialization Update on HB-800 Vacuum Furnace; Engaged with Multiple Micro LED and VCSEL Chipmakers, First Purchase Agreement Expected Before Year-End 2026

  • HUHUTECH International Group Inc. (NASDAQ:HUHU) Shares Shorted: Short Interest Down 60.1% in September

  • HUHUTECH Expects Two Japan Projects with Estimated Aggregate Value of Approximately $12 Million to Advance Toward Contracting in Q4 2026

  • HUHUTECH Reports 8.6% Revenue Growth for First Half of 2026, with New U.S., Germany, and Singapore Operations Contributing $3.7 Million

  • NOTICE TO DISREGARD — HUHUTECH International Group Inc.

  • Critical Review: HUHUTECH International Group (NASDAQ:HUHU) versus NXP Semiconductors (NASDAQ:NXPI)

  • Reviewing AYRO (NASDAQ:AYRO) and HUHUTECH International Group (NASDAQ:HUHU)

  • HUHUTECH's Japanese Subsidiary Selected Through Competitive RFP for a Multi-Year Tool Hook-Up Program at a Leading Japanese Semiconductor Manufacturer's Hiroshima Facility

  • HUHUTECH International Group (NASDAQ:HUHU) vs. Analog Devices (NASDAQ:ADI) Financial Analysis

  • HUHUTECH Expands Arizona Semiconductor Project Portfolio with Fifth Order Worth Approximately US$1.8 Million

  • HUHUTECH Begins Construction on Fourth Arizona Semiconductor Facility Project as First Three Projects Remain on Track for Completion Before Year-End 2026

  • HUHUTECH Annouced Fourth Purchase Order Awarded to U.S. Subsidiary by Its Arizona-Based Semiconductor Customer

  • HUHUTECH Annouced Fourth Purchase Order Awarded to U.S. Subsidiary by Its Arizona-Based Semiconductor Customer

  • HUHUTECH Surpasses RMB 13.1 Million in Cumulative Project Awards from BYD-Affiliated Facilities Since 2022

  • HUHUTECH Commercializes Nano-Aerogel Insulation Technology Through New Japanese Semiconductor Project

  • HUHUTECH Enters Semiconductor Equipment Market with In-House Developed HB-800 Vacuum Furnace

  • HUHUTECH International Group Provides Additional Details on €13.9 Million European Semiconductor Contract

  • HUHUTECH International Group Awarded Follow-On Contract from Anchor Customer to Support Continued Capacity Expansion in the Arizona Semiconductor Corridor