IQE plc
Other OTCCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Jutta Meier
- Full Time Employees
- 577
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Pascal Close Cardiff United Kingdom CF3 0LW
- IPO Date
- Aug 3, 2012
- Website
- iqep.com
- Similar Companies
- Business
- IQE plc IQE plc develops, manufactures and sells advanced compound semiconductor wafer products and material solutions to the global semiconductor industry. The company operates through three segments: Wireless, which supplies compound semiconductor materials including GaAs, GaN and InP for radio frequency devices in wireless communications; Photonics, which provides materials such as InP, GaAs, GaSb and InSb for optical communications, sensing, infrared imaging and display technologies including MicroLED; and CMOS++, which offers advanced semiconductor materials combining compound semiconductors with silicon technologies. IQE produces epiwafers using MOCVD and MBE platforms in wafer sizes from 50mm to 300mm, alongside high-purity substrates encompassing GaAs, InP, GaSb, InSb and InAs through subsidiaries Wafer Technology and Galaxy Compound Semiconductors; these enable applications in smart connected devices, communications infrastructure, automotive and industrial, aerospace and security, power electronics for electric vehicles and renewables, as well as 3D sensing. Founded in 1988 and headquartered in Cardiff, United Kingdom, IQE maintains manufacturing facilities in the UK including Newport, Cardiff and Milton Keynes; in the US including Taunton Massachusetts, Greensboro North Carolina and Spokane Washington; and in Taiwan, serving customers in the United States, rest of the Americas, Europe, Middle East, Africa, China, Japan and rest of Asia-Pacific. In recent developments, IQE expanded its strategic review in September 2025 to include the potential sale of the company following approaches from potential offerors and is advancing negotiations for the sale of its Taiwan operations to repay its HSBC revolving credit facility and March 2025 convertible loan notes while providing cash for core operations; the company completed a £1.1m ULTRARAM industrialisation project with Quinas Technology, progressed a joint development agreement with X-FAB for GaN sampling with automotive power customers, and continues development of higher-voltage GaN technologies over 1000V for automotive and radar markets through government-funded programs.
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