SEMI Total Solution INC

SEMI Total Solution INC

KKRX:0017J0
2,775.00
KRW
-280.00
(-9.17%)
-390.07EPS
137.27BMarket Cap
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
62,908.86
28,588.9
31,041.44
11,655.84
901.89
970.46
745.62
Basic EPS, GAAP
7,035.99
10,145.01
8,192
-8,507
318
290
-390.07
Free Cash Flow per Basic Share
-17,624.83
8,554.11
8,238.8
-9,408.95
459.79
573.44
308
Dividend per Share
95
24.29
- -
20.12
- -
- -
- -
Book Value per Share
277.83
546.13
814.45
622.56
882.85
1,195.12
2,351.79
Tangible Book Value per Share
276.94
543.46
806.63
613.82
874.98
1,186.48
2,343.85
Basic Weighted Avg Shares
- -
1
1
1
23
24
28
Sales/Revenue/Turnover
12,582
22,366
24,388
9,271
20,808
22,965
20,627
Operating Margin (%)
13.88
31.92
25.51
-70.28
28.36
27.84
16.66
Depreciation Expense
109
234
364
539
589
586
574
Net Income, GAAP
1,407
7,937
6,436
-6,766
7,337
6,862
-10,791
Effective Tax Rate (%)
5.33
0.98
0.23
- -
- -
1.01
- -
Profit Margin (%)
11.18
35.49
26.39
-72.98
35.26
29.88
-52.31
Working Capital
2,639
10,588
17,518
12,369
19,031
29,254
65,655
LT Debt
2
25
23
67
6
38
2,627
Total Equity
8,373
16,459
24,545
18,775
26,616
36,017
70,875
Return on Invested Capital (%)
- -
54.57
29.77
- -
- -
20.12
- -
Return on Capital (%)
- -
63.71
31.28
- -
- -
21.89
- -
Return on Common Equity (%)
- -
63.92
31.39
-31.25
32.34
21.92
-20.55

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
54
138
113
LT Borrowings
- -
- -
2,608
LT Finance Leases
38
29
19
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
30
30
30
Market Capitalization
- -
- -
137,272

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
42,873
38,634
68,911
Cash, Cash Equivalents & STI
34,369
33,649
59,352
Accounts Receivable, Net
2,078
1,621
2,281
Inventories
5,042
803
4,538
Total Current Liabilities
13,619
3,404
3,256
Payables & Accruals
- -
- -
- -
ST Debt
54
138
113
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
39.85%
35.32%
Free Cash Flow
- -
-144.51%
27.92%
Net Income, GAAP
- -
5.01%
-6.47%
Sales/Revenue/Turnover
- -
31.92%
10.36%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
630
2,616
20,808
2025
5,320
12,208
2,025
3,411
22,965
2026
12,697
2,494
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
78.93
318
2025
51
184
9.1
33.73
290
2026
228
-657
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Sector
Electronic technology
Industry
Semiconductors
Address
Yongin-si South Korea
Business
SEMI Total Solution INC is a South Korea-based technology company primarily engaged in the development, manufacturing, and distribution of semiconductor manufacturing equipment, precision components, and comprehensive engineering solutions. The company operates through three principal business divisions: Semiconductor Equipment, Precision Components, and Technical Solutions. Its product and service portfolio includes wafer processing and inspection equipment; high-precision vacuum chambers, valves, and machined replacement parts; semiconductor equipment modification, retrofitting, and refurbishment services; cleanroom automation and material handling systems; and specialized equipment maintenance, lifecycle management, and field engineering support. SEMI Total Solution INC serves integrated device manufacturers, semiconductor foundries, outsourced semiconductor assembly and test providers, and display panel fabricators across South Korea, Greater China, and the broader Asia-Pacific region. Founded in South Korea and headquartered in Gyeonggi-do, South Korea, the company operates dedicated manufacturing facilities, research and development laboratories, and customer support centers. In recent developments, SEMI Total Solution INC has expanded its advanced packaging and high-bandwidth memory equipment component offerings to address increasing demand in high-performance computing applications. The company has formed strategic partnerships with domestic chipmakers to accelerate the localization of critical vacuum parts, secured new capital to expand precision machining capacity, and broadened its overseas refurbished equipment distribution network to support international semiconductor manufacturing expansions.