DAEDUCK Co., Ltd.
14,240.00
KRW
+110.00
(+0.78%)
ISIN
KR7008060006
Return %
Stock
S&P 500
1Y
55.46
14.39
3Y
131.17
81.42
5Y
95.34
68.62
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Young-Jae Kim
- Full Time Employees
- 12
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- 230, Gangchon-ro Ansan-si GY South Korea 15602
- IPO Date
- Jan 26, 1989
- Website
- daeduckholdings.com
- Similar Companies
- Business
- Daeduck Co.,Ltd. (008060.KS) is a Korea-based holding company primarily engaged in the manufacturing and distribution of printed circuit boards (PCBs) through its subsidiaries. The company operates across segments including PCB production for semiconductor packaging, such as flip chip ball grid array (FCBGA), flip chip chip scale package (fcCSP), chip scale package (CSP), system in package (SiP), antenna in package (AiP), and flip chip board on chip (FCBOC); high-multilayer PCBs for networks, wired networks, optical modules, and 5G communications; thin PCBs for semiconductors; and solutions supporting AI servers, data centers, autonomous vehicles, and high-frequency applications. Its products serve the telecommunication, electronics, semiconductor, and automotive industries, with customers including global leaders in mobile devices, AI, and high-performance computing. Founded in 1972 and headquartered in Ansan-si, Gyeonggi-do, South Korea, Daeduck maintains manufacturing facilities in four locations in Korea and one in Vietnam, with sales offices in the United States, China, and Taiwan to support international operations. The company, formerly known as Daeduck Electronics Co., Ltd., underwent a major corporate restructuring in 2020 when it converted into a holding company structure, spinning off its core PCB manufacturing operations into Daeduck Electronics Co., Ltd. (353200.KS), which now functions as its primary operating subsidiary focused on advanced semiconductor package substrates and high-end PCBs. Daeduck GDS Co., Ltd., another integrated subsidiary, contributes to the group's PCB capabilities. In recent developments, Daeduck Electronics, the key operating arm, developed a large-body FCBGA substrate for AI servers and data centers in 2024, enhancing its position in high-performance computing markets previously dominated by Japanese and Taiwanese competitors, and partnered with Elohim Inc. to embed silicon capacitors in FCBGA substrates for next-generation packaging commercialization targeted by early 2025. The group has pursued strategic investments in FCBGA production since 2021, achieving mass production capabilities and collaborations with global OSAT firms for server applications, alongside ongoing advancements in bridge integration and coreless technologies. Additionally, Daeduck announced an equity buyback plan tranche update in July 2025, reflecting confidence in its financial position amid projected revenue growth and performance recovery across memory, non-memory, and multilayer PCB segments into 2026.