MK Electron Co., Ltd.

MK Electron Co., Ltd.

KKRX:033160
14,300.00
KRW
-800.00
(-5.30%)
940.05EPS
53.94P/E
340.09BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
26,970.15
22,169.76
20,182.08
30,243.21
21,138
20,300.74
34,746.54
41,926.5
45,817.04
49,749.03
53,098.31
55,983.89
66,497.13
75,159.05
Basic EPS, GAAP
999
-1,539
7,059
1,599
2,168
1,177
336
1,325
1,594
-563
-1,675
-1,285
63
281.81
Free Cash Flow per Basic Share
414.26
-36.05
7.97
-6,324.9
-4,641.27
1,710.58
-2,321.01
15,366.38
12,443.93
3,448.33
-17,630.04
7,300.82
-7,747.47
-10,917.43
Dividend per Share
150.01
159.14
154.02
838.31
626.18
790.85
1,138.19
611.39
735.98
825.73
687.74
522.58
516.49
- -
Book Value per Share
5,740.66
4,361.31
10,879.9
12,217.63
13,879.3
14,048.07
14,607.28
16,861.28
19,018.58
18,711.3
17,837.78
16,451.68
16,884.07
17,159.29
Tangible Book Value per Share
5,377.76
4,040.25
4,073.47
5,641.14
7,700.53
7,837.25
9,194.18
11,737.14
12,983.32
13,753.19
14,686.34
13,721.9
14,919.36
15,205.36
Basic Weighted Avg Shares
21
21
21
20
21
22
21
21
21
21
21
21
21
21
Sales/Revenue/Turnover
568,128
469,590
417,150
619,601
436,181
437,157
731,615
875,759
958,026
1,023,210
1,116,975
1,170,600
1,403,823
1,570,294
Operating Margin (%)
1.9
1.99
-0.99
20.26
1.74
39.73
17.32
12.68
11.33
7.85
4.16
4.79
1.01
1.94
Depreciation Expense
7,454
7,850
7,866
7,796
7,405
7,181
12,198
13,684
17,871
20,624
20,927
19,126
19,416
18,798
Net Income, GAAP
21,044
-32,598
145,905
32,759
44,736
25,346
7,075
27,677
33,330
-11,579
-35,235
-26,869
1,330
5,888
Effective Tax Rate (%)
22.34
- -
23.32
31.46
30.8
33.16
39.74
32.28
32.09
70.65
- -
- -
62.31
55.17
Profit Margin (%)
3.7
-6.94
34.98
5.29
10.26
5.8
0.97
3.16
3.48
-1.13
-3.15
-2.3
0.09
0.37
Working Capital
-14,326
-28,979
369,582
-119,557
-109,420
-119,362
-139,889
-117,940
-82,917
-85,176
-120,789
96,293
-16,292
-71,894
LT Debt
- -
- -
48,708
149,456
- -
1,490
654
14,164
55,068
47,694
7,494
432,270
328,097
337,920
Total Equity
122,899
94,451
523,061
615,737
744,639
848,837
873,677
917,844
1,025,885
1,017,450
977,115
914,068
1,001,507
1,019,501
Return on Invested Capital (%)
3.37
- -
3.31
9.18
12.27
10.7
6.54
6.19
5.6
1.71
- -
- -
0.25
0.75
Return on Capital (%)
10.4
- -
25.79
-3.81
-5.11
-6.91
-4.74
-1.35
-3.28
-1.55
- -
- -
-0.15
0.08
Return on Common Equity (%)
18.84
-30.54
92.51
13.85
16.27
8.47
2.34
8.42
8.89
-2.94
-9.18
-7.45
0.37
1.61

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
380,357
880,593
970,110
LT Borrowings
27,412
267,783
277,656
LT Finance Leases
373
60,314
60,264
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
21
22
22
Market Capitalization
185,831
187,946
340,093

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
402,597
1,082,516
1,114,144
Cash, Cash Equivalents & STI
53,742
169,484
150,962
Accounts Receivable, Net
213,080
201,436
247,977
Inventories
114,239
124,002
130,700
Total Current Liabilities
494,939
1,098,808
1,186,038
Payables & Accruals
- -
- -
- -
ST Debt
380,357
880,593
970,110
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
7.07%
2.02%
9.57%
Free Cash Flow
-8,098.87%
-212.58%
-207.14%
Net Income, GAAP
9.61%
-7.74%
-104.95%
Sales/Revenue/Turnover
15.63%
10.01%
19.92%
Total Cash Common Dividend
43.19%
-1.73%
-0.21%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
272,003
295,142
267,906
335,548
1,170,600
2025
283,652
336,132
376,944
407,094
1,403,823
2026
450,123
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-257.74
-372
104
-758.43
-1,285
2025
18
242.41
-63
-134.97
63
2026
227
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
522.58
2025
- -
- -
- -
- -
516.49
2026
- -
- -
- -
- -
- -

Company Description

CEO
Gi-Jin Hyeon
Full Time Employees
296
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Yongin-si South Korea
IPO Date
Nov 10, 1997
Website
mke.co.kr
Business
MK Electron Co., Ltd. is a South Korea-based company primarily engaged in the development, manufacture, and distribution of advanced packaging materials and components for the semiconductor and electronics industries. Founded in 1982 and headquartered in Yongin-si, Gyeonggi-do, South Korea, the company operates across semiconductor materials, electronic interconnects, and energy materials segments. The company's core product portfolio comprises bonding wires, including high-purity gold, copper, silver-based, and palladium-coated copper wires used to establish electrical interconnections between semiconductor dies and substrates; solder balls, including standard, fine, and micro solder balls designed for ball grid array, chip-scale packaging, and wafer-level packaging architectures; solder pastes and chemical fluxes for surface-mount technology and module assembly; palladium alloy wires and specialized contact materials for semiconductor test sockets and pogo pins; sputtering targets and high-purity evaporation metals for thin-film metallization; and silicon alloy composite anode materials for next-generation secondary lithium-ion batteries. MK Electron serves global integrated device manufacturers, outsourced semiconductor assembly and test providers, and electronics manufacturers across South Korea, China, Taiwan, Southeast Asia, the United States, and Europe, supported by manufacturing facilities in South Korea and its production subsidiary, MK Electron (Kunshan) Co., Ltd., in China. In recent strategic developments, the company completed the divestment of its environmental management subsidiary, Dongbu Entec, to realign its operational focus and reallocate capital toward its high-margin semiconductor materials business. The company is actively expanding its production capacity and research initiatives in micro-pitch solder balls, advanced palladium alloy probe materials, and next-generation interconnect solutions to meet accelerating demand in artificial intelligence servers, high-bandwidth memory packaging, and advanced memory modules.