Signetics Corporation
KKRX:0331703,140.00
KRW
-50.00
(-1.57%)
ISIN
KR7033170002
Return %
Stock
S&P 500
1Y
-30.99
14.20
3Y
-40.30
81.12
5Y
-61.35
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Young-Hee Song
- Full Time Employees
- 123
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- Paju-si South Korea
- IPO Date
- Nov 26, 2010
- Website
- signetics.com
- Similar Companies
- Business
- Signetics Corporation is a South Korea-based outsourced semiconductor assembly and test (OSAT) provider that specializes in back-end packaging and testing solutions for integrated circuits across memory and non-memory semiconductor sectors. The company offers an extensive portfolio of semiconductor packaging technologies, including flip-chip packages such as flip-chip ball grid array (FC-BGA), flip-chip quad flat no-lead (FC-QFN), and flip-chip land grid array (FC-LGA); laminate substrate packages such as fine-pitch ball grid array (FBGA), plastic ball grid array (PBGA), multi-chip modules (MCM), and multi-chip packages (MCP); leadframe packages such as quad flat no-lead (QFN), thin quad flat packages (TQFP), low-profile quad flat packages (LQFP), thin small outline packages (TSOP), and small outline integrated circuits (SOIC); and wafer-level chip scale packaging (WLCSP). In addition to packaging assembly, the company provides turnkey testing and engineering services, including wafer probe and sorting; final package electrical testing; burn-in stress screening; high-temperature and humidity reliability qualification; thermal and electrical simulation; and custom test program development. Signetics caters to global semiconductor manufacturers, integrated device manufacturers (IDMs), and fabless design houses, supplying components utilized in artificial intelligence (AI) hardware, high-performance computing (HPC), mobile devices, automotive electronics, telecommunications infrastructure, and consumer electronics, with primary customer relationships including Samsung Electronics and SK Hynix. In recent developments, the company has undertaken major international manufacturing expansion by investing 100 million USD to establish an advanced semiconductor assembly and test production facility in the Ba Thien I Industrial Park in Vinh Phuc Province, Vietnam, designed to broaden capacity for high-density packaging. Additionally, Signetics has intensified research and development in advanced packaging architectures to support burgeoning demand for AI and on-device AI processors, and executed a five-to-one reverse stock split to optimize share liquidity and stabilize its capital base. Founded in 1966 and headquartered in Paju, Gyeonggi-do, South Korea, Signetics Corporation operates as a specialized semiconductor affiliate of the Young Poong Group.