Nepes Corporation
KKRX:03364023,300.00
KRW
-150.00
(-0.64%)
ISIN
KR7033640004
Return %
Stock
S&P 500
1Y
40.11
14.20
3Y
40.96
81.12
5Y
-29.61
68.34
Capital Structure
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in mil. unless spec.Working Capital
KRW
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Byung-Koo Lee
- Full Time Employees
- 1,200
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- 105 Geumil-ro 965beon-gil Eumseong-gun NC South Korea
- IPO Date
- Dec 14, 1999
- Website
- nepes.co.kr
- Similar Companies
- Business
- Nepes Corporation operates across the semiconductor, advanced materials, and energy sectors from its base in South Korea. The company delivers comprehensive backend solutions for semiconductors, encompassing sophisticated packaging techniques such as flip chip bumping, various wafer-level packaging methods, and pioneering fan-out panel-level packaging. These innovations provide compact, high-performance designs for consumer electronics, industrial applications, and automotive systems. Furthermore, Nepes is actively developing and supplying specialized artificial intelligence semiconductors and AI-driven solutions for factory optimization and visual inspection systems. In its materials division, the firm manufactures a range of functional photo and wet chemical products essential for semiconductor and display fabrication, serving applications in modern smartphones and vehicles. Beyond this, Nepes produces lead tabs for advanced secondary batteries, vital for energy storage and automotive uses, alongside smart films designed to control window transparency in eyewear, augmented/virtual reality devices, vehicle sunroofs, and switchable mirrors. Recently, Nepes has made significant strides in next-generation packaging technologies for AI and high-bandwidth memory, including 2.5D packaging and Package on Package (PoP) solutions, targeting commercialization by the second half of 2025. The company has secured substantial orders for low-power Power Management Integrated Circuits (PMICs) for AI servers and is expanding its capabilities for 3D-IC packaging through strategic technology partnerships. Established in 1990, Nepes Corporation maintains its headquarters in Cheongju-si, South Korea.