- CEO
- Seung-Hwan Choi
- Full Time Employees
- 310
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Anyang South Korea
- IPO Date
- Aug 17, 2001
- Business
- Protec Co., Ltd. is a South Korea-based technology company engaged in the development, manufacture, and distribution of semiconductor backend packaging equipment, surface-mount technology automation systems, and precision pneumatic components. The company operates primarily through two core business divisions: the System Division and the Pneumatic Division, supplemented by test interface operations through its subsidiary PMT Inc. Its product portfolio includes high-precision fluid dispensing systems, such as automated epoxy dispensers, high-speed jetting dispensers, underfill systems, and optical device dispensers; advanced laser bonding machinery, including Laser-Assisted Bonding (LAB) equipment and Laser Compression (LC) bonders designed for high-density micro-pitch interconnection; precision die bonders and die attach systems; specialized DRAM sorting and quality inspection equipment tailored for high-bandwidth memory (HBM) production workflows; solder ball attachment systems; automated tray feeders and board transfer mechanisms; and industrial pneumatic components, comprising standard and compact pneumatic cylinders, air grippers, rotary actuators, and motion control valves. Protec serves major integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) providers, and electronic components manufacturers across South Korea, China, Taiwan, Southeast Asia, North America, and Europe. Founded in 1997 and headquartered in Anyang-si, Gyeonggi-do, South Korea, the company maintains subsidiaries including PMT Inc., a manufacturer of semiconductor probe cards, and Minosys Co., Ltd., a provider of automation software solutions. In recent developments, Protec has accelerated the commercial deployment of its proprietary Laser-Assisted Bonding (LAB) and Laser Compression (LC) bonding platforms to address thermal warpage and fine-pitch assembly challenges in next-generation 2.5D, 3D, and AI-driven HBM packaging architectures. The company has also expanded its supply footprint to tier-one memory manufacturers with the delivery of high-speed DRAM sorting equipment used for multi-stage chip classification prior to HBM stacking, expanded direct equipment evaluations and partnerships with global OSATs and international foundries, and strengthened its consolidated operations through increased equity control and operational integration with its probe card subsidiary PMT Inc.