Telechips Inc.

Telechips Inc.

KKRX:054450
8,290.00
KRW
+130.00
(+1.59%)
-3,875.37EPS
172.26BMarket Cap
Nov 18Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
6,404.63
6,484.21
7,098.58
8,707.36
8,020.02
10,204.96
10,539.47
8,014.44
10,844.86
11,403.84
13,347.11
12,641.13
13,060.42
14,475.58
Basic EPS, GAAP
-1,499.23
123.08
174.62
906.92
100.77
746
663
-749
559
3,480
4,375
-2,612
-4,175
-3,875.37
Free Cash Flow per Basic Share
-697.91
-101.27
-833.1
5
79.92
-517.91
476.67
-2,442.78
-2,782.98
-8,015.64
-2,012.97
-2,720.34
-3,082.08
-3,365.44
Dividend per Share
38.46
- -
53.93
61.48
75.74
72.49
119.54
119.76
- -
114.4
124.06
199.98
60
- -
Book Value per Share
5,956.09
5,964.91
6,081.63
6,946.81
7,038.1
7,762.69
8,210.26
7,358
8,452.79
12,418.23
16,678.55
13,666.94
9,685.84
9,753.65
Tangible Book Value per Share
5,435.13
5,435.29
4,894.74
5,194.6
5,835.08
6,758.67
6,661.5
5,694.72
5,301.87
6,961.05
10,445.91
5,342.8
2,175.83
519.78
Basic Weighted Avg Shares
12
12
12
12
15
12
13
13
13
13
14
15
15
15
Sales/Revenue/Turnover
74,011
75,272
82,106
100,970
122,667
126,099
132,196
100,722
136,412
150,404
191,095
186,616
192,802
213,678
Operating Margin (%)
-10.7
2.27
5.56
6.58
5.16
6.47
5.78
-8.41
5.92
6.1
8.78
2.61
-3.21
1.18
Depreciation Expense
11,058
6,498
3,423
5,067
10,948
7,761
9,250
8,923
10,886
12,863
12,171
10,153
9,361
8,858
Net Income, GAAP
-17,325
1,429
2,020
10,517
1,541
9,218
8,316
-9,413
7,031
45,897
62,638
-38,560
-61,633
-57,205
Effective Tax Rate (%)
- -
51.44
2.72
- -
- -
- -
- -
- -
11.37
3.99
3.12
- -
- -
- -
Profit Margin (%)
-23.41
1.9
2.46
10.42
1.26
7.31
6.29
-9.35
5.15
30.52
32.78
-20.66
-31.97
-26.77
Working Capital
50,351
51,127
44,116
43,512
51,489
50,750
49,944
54,885
47,599
17,742
95,949
27,355
-3,553
-15,234
LT Debt
- -
- -
- -
- -
- -
- -
705
21,629
35,864
31,571
53,121
50,460
66,750
78,385
Total Equity
68,832
69,101
70,454
80,476
81,958
96,995
102,974
92,448
106,277
169,670
246,197
201,742
142,976
143,977
Return on Invested Capital (%)
- -
1.2
6.37
- -
- -
- -
- -
- -
5.15
4.35
5.58
- -
- -
- -
Return on Capital (%)
- -
2.07
2.89
- -
- -
- -
- -
- -
5.95
23.8
22.81
- -
- -
- -
Return on Common Equity (%)
-22.33
2.07
2.89
13.94
1.9
10.3
8.32
-9.63
7.08
33.27
30.12
-17.22
-35.76
-33.52

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
65,017
64,460
73,460
LT Borrowings
67,615
66,750
78,385
LT Finance Leases
983
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
15
15
15
Market Capitalization
191,454
235,886
172,264

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
121,036
136,229
120,644
Cash, Cash Equivalents & STI
51,287
51,043
44,190
Accounts Receivable, Net
22,051
36,474
27,299
Inventories
32,972
36,109
34,725
Total Current Liabilities
99,861
139,782
135,879
Payables & Accruals
- -
- -
- -
ST Debt
65,017
64,460
73,460
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
10.29%
14.5%
-29.13%
Free Cash Flow
67.4%
39.19%
13.3%
Net Income, GAAP
92.33%
62.56%
59.84%
Sales/Revenue/Turnover
10.2%
14.74%
3.32%
Total Cash Common Dividend
- -
- -
-70%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
45,380
45,998
47,606
47,632
186,616
2025
45,204
44,303
50,246
53,050
192,802
2026
66,080
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-418
-1,059
-660
-475.08
-2,612
2025
-236
-218.13
-278.17
-3,443
-4,175
2026
63.93
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
199.98
2025
- -
- -
- -
- -
60
2026
- -
- -
- -
- -
- -

Company Description

CEO
Jang-Gyu Lee
Full Time Employees
489
Sector
Electronic technology
Industry
Semiconductors
Address
Seongnam-si South Korea
IPO Date
Dec 10, 2004
Business
Telechips Inc. is a South Korea-based fabless semiconductor design company that specializes in the development and commercialization of system-on-chip (SoC) solutions, application processors, and microcontrollers primarily for the global automotive and multimedia electronics industries. Founded in 1999 and headquartered in Seongnam-si, South Korea, the company operates international sales, research, and technical support subsidiaries across the United States, Germany, China, Japan, and Singapore, serving original equipment manufacturers (OEMs) and global Tier-1 automotive suppliers. The company's primary product and service offerings comprise: Automotive Digital Cockpit and In-Vehicle Infotainment (IVI) Processors marketed under the Dolphin series (including Dolphin+, Dolphin3, and Dolphin5), which drive digital instrument clusters, head-up displays (HUD), center information displays, and multi-camera surround view systems; Advanced Driver Assistance Systems (ADAS) and Autonomous Driving Vision SoCs marketed under the N-Dolphin series, featuring integrated neural processing units (NPUs) dedicated to camera-based object detection, driver monitoring systems (DMS), and occupant monitoring systems (OMS); High-Performance Automotive Microcontroller Units (MCUs) and Network Gateway Processors marketed under the AXON series, engineered for vehicle body control, functional safety management, and secure domain routing; Digital Radio and Media Broadcast Receivers, supporting global transmission standards including DAB/DAB+, DRM, and HD Radio; and Consumer Multimedia Application Processors, utilized in smart set-top boxes, connected home appliances, and display devices. In addition to hardware, Telechips delivers comprehensive software development kits, board support packages, and middleware supporting Android, Linux, and automotive real-time operating systems. In recent strategic developments, Telechips has expanded its focus on software-defined vehicle (SDV) architectures and centralized domain control through the rollout and customer sampling of its Dolphin5 next-generation AI cockpit processor and N-Dolphin AI vision processor lines fabricated on advanced FinFET process nodes. The company has broadened strategic collaborations with leading semiconductor foundries and automotive software vendors to enhance virtualization, cyber security, and ISO 26262 functional safety compliance. Furthermore, Telechips has accelerated international commercial expansion, securing multi-year platform design wins with global Tier-1 automotive suppliers across North America, Europe, and Asia to diversify its customer portfolio beyond traditional domestic automotive partnerships.