LB Semicon, Inc.
KKRX:0619703,140.00
KRW
-195.00
(-5.85%)
ISIN
KR7061970000
Return %
Stock
S&P 500
1Y
-35.38
14.20
3Y
-43.67
81.12
5Y
-72.27
68.34
Capital Structure
KRW
•
in mil. unless spec.Working Capital
KRW
•
in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
KRW
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in mil. unless spec.Quarterly Dividends Per Share
KRW
•
in mil. unless spec.Company Description
- CEO
- Dae-Kyo Lee
- Full Time Employees
- 1,513
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- 138, Cheongbuksandan-ro Pyeongtaek-si GY South Korea 07796
- IPO Date
- Jan 31, 2011
- Website
- lbsemicon.com
- Similar Companies
- Business
- LB Semicon Inc. (KOSDAQ: 061970) manufactures and provides outsourced semiconductor assembly and test (OSAT) services, specializing in flip-chip wafer bumping, probe testing, back-end processing, and wafer-level chip scale packaging (WLCSP) for display driver ICs (DDI), CMOS image sensors (CIS), power management ICs (PMIC), and other chips used in electronic devices such as TVs, monitors, mobile phones, and AI data centers; core offerings include gold bumped wafers for chip-on-glass (COG), chip-on-film (COF), and chip-on-plastic (COP) packages; solder bumps and Cu pillar bumps for flip-chip applications; Au redistribution layer (RDL) for I/O pad repositioning; thick Cu products; chip probe testing; and comprehensive back-end services encompassing laminating, back grinding, laser marking and grooving, sawing (SAW), plasma cleaning, automated visual inspection (AVI), UV irradiation, pick-and-place, visual inspection, packing, back side coating, foil mounting, and tape-and-reel. The company operates production facilities and sales offices in South Korea (Pyeongtaek-si and Anseong-si, Gyeonggi-do), the United States (San Jose, California), Singapore, and Taiwan (Hsinchu County). Founded in February 2000 and headquartered at 138 Cheongbuksandan-ro, Cheongbuk-myeon, Pyeongtaek-si, Gyeonggi-do, South Korea, LB Semicon listed on KOSDAQ in January 2011 and employs approximately 1,530 people with 2024 revenue of KRW 4,509 billion. Recent developments include the acquisition of the remaining 51.22% stake in subsidiary LB Lusem Co., Ltd. for KRW 56.6 billion in October 2024 to strengthen integrated packaging capabilities; a collaboration with SK keyfoundry announced in July 2025 to co-develop direct RDL technology on 8-inch wafers, enhancing next-generation semiconductor packaging reliability; and plans with LB Lusem, announced in December 2024, to launch turn-key packaging for AI data center power management chips featuring back grinding back metal (BGBM), RDL, ENIG, Taiko grinding, and MOSFET processing starting mid-2025 at initial capacity of 1,000 wafers per month, alongside development of embedded substrate power supplies with partners in Japan and the US.