KOREA ADVANCED MATERIALS Co.,Ltd. is a South Korea-based manufacturing company primarily engaged in the development, fabrication, and distribution of precision semiconductor packaging components and advanced electronic materials. Founded in 1978 and headquartered in Busan, South Korea, the company operates as an affiliate of the HLB Group, catering to integrated device manufacturers and outsourced semiconductor assembly and test providers across South Korea, the Asia-Pacific region, and global export markets.
The company operates primarily through its semiconductor materials and precision stamping business segments. Its core product and service offerings include integrated circuit lead frames; discrete and transistor lead frames; high-reliability power semiconductor and automotive electronic lead frames; light-emitting diode lead frames; fine-pitch etched and high-speed stamped lead frames; continuous reel-to-reel electroplating services including gold, silver, nickel, and tin plating; precision progressive stamping dies and mold tooling; and custom metal stamped components and connectors. These products are engineered for deployment across diverse end markets, including automotive electronics, industrial automation, telecommunications infrastructure, consumer electronics, and power management systems.
In recent corporate developments, the company executed a comprehensive corporate reorganization and rebranded from PSMC Co., Ltd. to Korea Advanced Materials Co., Ltd. following its acquisition by the HLB Group consortium, signaling a strategic transition to expand beyond traditional packaging into high-value advanced materials and next-generation electronic components. Supported by strategic capital restructuring and financing initiatives, the company has upgraded its production automation facilities and advanced its research and development programs focused on high-power semiconductor packaging solutions, thermal management substrates, and electric vehicle electronic components. In addition, the company has broadened its commercial partnerships with domestic and international semiconductor packaging and testing contractors to supply next-generation, high-density lead frame platforms.