DAP Co., Ltd.
KKRX:0669001,745.00
KRW
+25.00
(+1.45%)
ISIN
KR7066900002
Return %
Stock
S&P 500
1Y
-11.11
14.39
3Y
-39.09
81.42
5Y
-54.14
68.62
Capital Structure
KRW
•
in mil. unless spec.Working Capital
KRW
•
in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
•
in mil. unless spec.Quarterly Earnings Per Share
KRW
•
in mil. unless spec.Quarterly Dividends Per Share
KRW
•
in mil. unless spec.Company Description
- Full Time Employees
- 1,127
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- Anseong-si South Korea
- IPO Date
- May 14, 2004
- Website
- dap.co.kr
- Similar Companies
- Business
- DAP Co., Ltd. is a South Korea-based electronic components manufacturer primarily engaged in the development, manufacturing, and distribution of high-density printed circuit boards (PCBs) for consumer electronics, automotive systems, and telecommunications equipment. Founded in 1987 and headquartered in Anseong, Gyeonggi-do, South Korea, the company operates advanced manufacturing facilities in South Korea and maintains international sales networks across Asia, North America, and Europe. The company's core product portfolio includes High-Density Interconnect (HDI) PCBs; any-layer HDI and micro-via build-up boards for smartphones, tablet PCs, smartwatches, and memory modules; Multi-Layer Printed Circuit Boards (MLB) ranging from standard 4-layer configurations to ultra-high-layer substrates for networking devices, display panels, and computing systems; rigid-flex PCBs for compact consumer devices; and specialized, high-reliability automotive PCBs designed for Advanced Driver Assistance Systems (ADAS), 77GHz/79GHz automotive radar sensor modules, electronic control units (ECUs), electric vehicle (EV) battery management systems (BMS), powertrain electronics, and in-vehicle infotainment (IVI) systems. In addition to hardware fabrication, the company offers engineering services encompassing thermal management design, high-frequency signal integrity verification, rapid prototyping, and surface mount technology (SMT) assembly support. In recent strategic developments, DAP Co., Ltd. has actively pivoted its revenue structure from mobile handset HDI boards toward high-value automotive electronics and autonomous driving sensor modules to counter smartphone market saturation and capitalize on electric and autonomous vehicle growth. To accelerate this transition, the company has expanded its manufacturing capabilities for high-frequency radar PCBs and automotive safety components, securing supplier certifications and deepening commercial relationships with premier automotive Tier-1 suppliers and global automotive original equipment manufacturers (OEMs). Furthermore, the company has enhanced its production efficiency and quality control infrastructure through automation investments across its primary Anseong plant and consolidated its global supply chain operations to serve major technology conglomerates in mobile, automotive, and industrial electronics sectors.