Duksan Hi-Metal Co., Ltd.
KKRX:07736011,200.00
KRW
+120.00
(+1.08%)
ISIN
KR7077360006
Return %
Stock
S&P 500
1Y
67.92
14.39
3Y
70.47
81.42
5Y
74.32
68.62
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Chang-Yeol Choi
- Full Time Employees
- 299
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Ulsan South Korea
- IPO Date
- Oct 14, 2005
- Website
- dshm.co.kr
- Similar Companies
- Business
- Duksan Hi-Metal Co., Ltd. is a South Korea-based materials manufacturing company primarily engaged in the development, production, and distribution of advanced electronic and semiconductor packaging materials. Founded in 1999 and headquartered in Ulsan, South Korea, the company supplies integrated device manufacturers, outsourced semiconductor assembly and test providers, and printed circuit board fabricators across domestic and international markets, including China, Taiwan, Vietnam, the United States, and Europe. The company operates across specialized electronic materials and aerospace-defense technology segments. Its primary product and service offerings comprise micro solder balls and standard spherical solder balls engineered for Ball Grid Array, Chip Scale Package, and Flip Chip semiconductor packaging; Copper Core Balls and polymer core solder balls utilized in high-density interconnects to provide uniform joint height and enhanced thermal-mechanical reliability; solder pastes, fluxes, and liquid chemical agents formulated for high-precision surface mount technology and component assembly; solder powders, alloy preforms, and specialized ribbons applied in thermal interface management and microelectronic bonding; and conductive particles and pastes for display panel and electronic circuit interconnections. Through its defense and aerospace subsidiary, Navcours Co., Ltd., the company also designs and manufactures high-precision Global Navigation Satellite System positioning modules, anti-jamming GPS systems, and guidance-control electronics for defense, aviation, and autonomous navigation applications. In recent strategic developments, Duksan Hi-Metal has accelerated its expansion into advanced packaging solutions for artificial intelligence accelerators, high-performance computing chipsets, and High Bandwidth Memory modules. The company has expanded commercial manufacturing of sub-micron and ultra-fine pitch micro solder balls alongside next-generation Copper Core Balls optimized for 2.5D and 3D heterogeneous packaging architectures. To strengthen its global supply chain and support growing assembly capacity in Southeast Asia, the company has ramped up production lines at its overseas manufacturing subsidiary, DS Vina, located in Vietnam. Additionally, Duksan Hi-Metal continues to advance its defense electronics footprint through strategic contracts for satellite navigation and anti-spoofing defense systems, while exploring next-generation bonding materials for electric vehicle power modules and high-frequency communication devices.