HB Technology Co., Ltd.

HB Technology Co., Ltd.

KKRX:078150
1,856.00
KRW
-16.00
(-0.85%)
521.71EPS
3.78P/E
178.15BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
2,598.97
1,798.28
1,916.42
3,571.26
3,699.2
3,542.75
3,625
3,590.6
2,080.02
1,948
1,383.98
1,828.47
1,806.13
1,875.24
Basic EPS, GAAP
385
18
90
388
490
88
41
47
151
358
983
-581
320
530.34
Free Cash Flow per Basic Share
-124.74
18.21
163.66
559.52
535.53
-330.67
19.41
186.43
-315.76
-139.46
-268.28
-124.69
-88.52
146.63
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
48.3
20.04
19.92
20.01
20.02
- -
Book Value per Share
1,039.67
1,048.01
1,142.58
1,603.18
2,011.1
2,012.33
2,079.5
2,163.85
2,364.1
2,744.12
3,503.28
2,889.06
3,208.47
3,391.4
Tangible Book Value per Share
756.13
779.09
904.59
1,408.35
1,875.24
1,432.46
1,566.88
1,705.96
2,307.23
2,692.03
3,462.34
2,860.33
3,155.22
3,290.18
Basic Weighted Avg Shares
56
74
76
76
77
77
77
76
76
76
81
89
89
89
Sales/Revenue/Turnover
144,295
133,328
145,657
270,466
285,224
273,911
280,566
274,248
158,891
148,055
111,647
162,369
160,311
166,623
Operating Margin (%)
11.42
1.92
6.93
14.07
16.82
3.71
3.6
1.79
-14.13
4.63
-19.76
-10.17
3.89
5.9
Depreciation Expense
5,096
8,568
8,672
9,599
8,967
9,293
14,061
13,759
8,780
4,802
4,150
3,493
3,598
3,693
Net Income, GAAP
21,375
1,335
6,840
29,385
37,781
6,804
3,173
3,590
11,535
27,209
79,300
-51,593
28,403
47,123
Effective Tax Rate (%)
- -
41.72
8.68
20.23
20.54
18.89
32.9
35.37
25.62
25.78
18.29
- -
13.39
18.58
Profit Margin (%)
14.81
1
4.7
10.86
13.25
2.48
1.13
1.31
7.26
18.38
71.03
-31.78
17.72
28.28
Working Capital
8,460
13,331
24,386
51,416
84,887
79,612
91,163
93,647
65,705
13,376
41,109
28,141
24,650
43,801
LT Debt
18,506
14,132
9,637
6,649
3,662
5,675
5,149
3,283
43,701
2,441
504
13,327
80
51
Total Equity
77,201
79,176
86,444
121,498
156,097
174,552
185,301
203,276
180,504
206,229
311,282
256,706
285,087
301,342
Return on Invested Capital (%)
- -
1.45
9.08
25.78
24.96
4.57
3.42
1.47
-7.22
2.06
-6.08
- -
1.73
2.51
Return on Capital (%)
- -
1.84
7.15
25.18
25.61
3.39
0.78
3.38
6.19
11.75
26.72
- -
9.09
14.77
Return on Common Equity (%)
47.49
1.71
8.26
28.26
27.22
4.38
2.02
2.21
6.69
14.09
30.65
-18.17
10.48
16.95

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
47,544
47,667
45,197
LT Borrowings
- -
- -
- -
LT Finance Leases
131
80
51
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
89
89
89
Market Capitalization
183,929
165,003
178,154

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
100,151
103,899
123,889
Cash, Cash Equivalents & STI
38,676
31,073
64,547
Accounts Receivable, Net
18,092
33,859
21,924
Inventories
27,006
21,478
20,361
Total Current Liabilities
76,572
79,249
80,088
Payables & Accruals
- -
- -
- -
ST Debt
47,544
47,667
45,197
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
14.42%
9.5%
11.06%
Free Cash Flow
51.9%
-59.83%
-29.04%
Net Income, GAAP
46.45%
45.71%
-155.05%
Sales/Revenue/Turnover
5.8%
-5.86%
-1.27%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
29,132
60,692
43,507
29,037
162,369
2025
30,012
42,289
36,164
51,846
160,311
2026
36,325
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
259
-223
-291
-325.87
-581
2025
-6
95.38
190.84
39.82
320
2026
204.31
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
20.01
2025
- -
- -
- -
- -
20.02
2026
- -
- -
- -
- -
- -

Company Description

CEO
Sung-Jun Moon
Full Time Employees
358
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Sejong South Korea
IPO Date
Dec 8, 2004
Business
HB Technology Co., Ltd. is a South Korea-based company primarily engaged in the development, manufacture, and distribution of automated optical inspection systems, laser repair machinery, and precision optical materials for the flat panel display, semiconductor, and secondary battery industries. Founded in 1997 and headquartered in Asan-si, South Korea, the company operates primarily through two core business divisions: the Equipment Division and the Component and Materials Division. The company's product and service portfolio includes Automated Optical Inspection (AOI) systems for liquid crystal displays (LCD), active-matrix organic light-emitting diode (AMOLED) panels, and printed circuit boards; laser repair systems engineered to eliminate micro-defects and restore circuit connectivity on display panels; high-precision optical inspection and repair tools for next-generation glass-core semiconductor substrates; integrated external inspection systems for secondary battery cells; edge crack testing machines; printed circuit board thickness gauges; die-matching meters; light guide plates (LGP) and light diffusion plates utilized in display backlight units (BLUs); and comprehensive equipment installation, calibration, refurbishment, and technical maintenance services. HB Technology serves tier-one technology conglomerates, display manufacturers, and clean-energy producers across South Korea, China, the United States, and broader international markets. In recent operational developments, the company has accelerated its strategic diversification into advanced semiconductor packaging technologies and electric vehicle battery supply chains. Most notably, HB Technology has positioned itself as a core equipment supplier in the commercial glass substrate sector, securing agreements to provide specialized high-precision AOI and laser repair equipment to Absolics for its manufacturing operations in Georgia, United States. Furthermore, the company has expanded its equipment offerings to support Gen 8.6 IT OLED production lines for major global display panel makers and widened the commercial footprint of its automated surface defect inspection systems within the secondary battery manufacturing sector.