Techwing, Inc. (089030.KQ) develops, manufactures, sells and services semiconductor inspection and test equipment in South Korea and internationally. The company offers wafer probing systems that test electrical properties of chips on wafers; cube probers for die-level testing; memory and SOC handlers used in final-stage semiconductor production testing; burn-in chambers and sorters that inspect direct current characteristics of integrated circuits; vision inspection equipment employing cameras for video and image capture of semiconductor products; motion controllers; chillers to maintain stable temperatures in semiconductor and display manufacturing; semiconductor test boards connecting signals between testers and handlers; and change-over kits creating inspection environments in test handlers. It also provides automotive products; module test handlers; test solutions; and vision solutions including handler vision options, 3D inspection technology, and optical design and verification technology, with a core focus on memory test handlers and emerging high-bandwidth memory (HBM) test equipment. Techwing, founded in 2002, is headquartered in Hwaseong-si, South Korea, and operates primarily in markets including China, Japan, Malaysia, Thailand and Taiwan. Recent developments include anticipation of substantial revenue growth exceeding 123% in the coming year driven by demand for advanced semiconductor testing solutions, alongside expectations of KRW 93.3 billion in funding from Daishin Growth Capital 2024 Private Equity Fund to support expansion.