- CEO
- Myung-Soon Park
- Full Time Employees
- 229
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Bucheon-si South Korea
- IPO Date
- Nov 8, 2006
- Business
- KOSES Co., Ltd. is a South Korea-based semiconductor equipment manufacturer primarily engaged in the development, production, and marketing of advanced back-end packaging machinery, laser application systems, and precision automation equipment. Founded in 1990 as Korea Semiconductor System Co., Ltd. and headquartered in Bucheon-si, Gyeonggi-do, South Korea, the company operates across the global semiconductor, next-generation display, and rechargeable battery sectors, serving leading integrated device manufacturers, outsourced semiconductor assembly and test providers, display panel fabricators, and battery cell producers in South Korea, China, the wider Asia-Pacific region, and North America. The company's core product portfolio encompasses Solder Ball Attach Systems, comprising high-speed automatic solder ball placement systems, wafer-level ball mounters, and visual inspection kits for Ball Grid Array, Chip Scale Package, and flip-chip packaging architectures; Laser Processing Systems, including high-precision laser marking machines, laser dicing and sawing tools, laser drilling units, and laser ablation systems; Display Manufacturing and Repair Equipment, specializing in proprietary MicroLED and MiniLED laser repair and rework systems that detect and replace defective micro-pixel elements for advanced augmented reality, virtual reality, and commercial display applications; Package Handling and Stack Automation, comprising Package-on-Package stack systems, flux pre-cleaning equipment, substrate merge and sorting machinery, router systems, and automated loader/unloader units; and Secondary Battery Manufacturing Equipment, including high-precision laser cutting, notch slitting, and tab-welding automation systems for electric vehicle and energy storage pouch and prismatic battery cells. In recent operational developments, KOSES has accelerated its strategic diversification into the clean energy and advanced computing sectors by expanding commercial supply contracts for secondary battery laser automation equipment with North American battery manufacturers, enhancing its next-generation ultra-fine-pitch solder ball attach platforms to address the high-density requirements of 2.5D and 3D artificial intelligence packaging, and broadening customer deployment of its high-yield MicroLED laser repair solutions across international consumer electronics supply chains.