VM Inc.

VM Inc.

KKRX:089970
42,000.00
KRW
-3,250.00
(-7.18%)
2,593.39EPS
40.04P/E
2.67TMarket Cap
Nov 18Next Earn
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
2,323.04
2,082.25
1,925.36
2,790.53
2,748.78
4,426.58
8,265.45
6,582.86
1,204.36
3,197.51
6,272.37
10,285.4
Basic EPS, GAAP
-1,116
764
508
799
656
1,112
2,156.64
1,298
-323
-157
1,135
2,730.03
Free Cash Flow per Basic Share
-1,018.83
303.1
284.49
967.61
525.54
534.1
2,391.66
-439.79
-801.36
726.35
405.45
2,125.02
Dividend per Share
- -
- -
- -
- -
204.55
- -
705.87
1,002.92
- -
- -
- -
- -
Book Value per Share
-127.8
496.4
1,010.56
2,420.27
2,797.04
4,113.49
5,297.14
5,529.01
5,588.9
5,642.29
7,258.73
10,539.11
Tangible Book Value per Share
-131.85
491.09
1,006.5
2,411.58
2,790.23
4,095.99
5,279.69
5,503.71
5,569.26
5,625.61
7,219.21
10,502.2
Basic Weighted Avg Shares
2
18
21
22
22
21
22
21
22
22
23
24
Sales/Revenue/Turnover
4,400
37,851
41,122
61,038
59,326
93,030
178,054
141,385
26,009
70,277
144,412
248,480
Operating Margin (%)
-39.84
24.81
30.86
34.52
27.18
31.84
30.34
21.88
-42.15
-12.24
17.09
27.59
Depreciation Expense
115
188
270
351
419
600
1,089
1,600
1,631
1,658
1,756
- -
Net Income, GAAP
-2,114
13,888
10,850
17,477
14,158
23,370
46,458
27,878
-6,975
-3,451
26,132
65,953
Effective Tax Rate (%)
- -
- -
15.28
21.06
20.44
20.11
21.11
20.54
- -
- -
4.11
18.77
Profit Margin (%)
-48.04
36.69
26.38
28.63
23.87
25.12
26.09
19.72
-26.82
-4.91
18.1
26.54
Working Capital
-5,194
4,368
17,773
47,376
54,103
83,738
105,456
107,898
113,751
111,130
155,633
236,236
LT Debt
- -
- -
- -
- -
4
275
1,281
911
527
106
160
- -
Total Equity
-3,028
11,762
23,944
53,425
59,502
89,656
114,103
117,912
122,174
124,301
177,198
257,277
Return on Invested Capital (%)
- -
- -
57.24
41.95
22.15
30.32
38.24
19.76
- -
- -
15.43
27.52
Return on Capital (%)
- -
- -
57.57
45.18
25.1
31.27
45.16
23.8
- -
- -
18.13
34.18
Return on Common Equity (%)
- -
- -
60.77
45.18
25.08
31.34
45.6
24.03
-5.81
-2.8
17.33
33.92

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
247
160
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
160
131
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
24
24
24
Market Capitalization
737,233
945,953
2,668,198

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
223,844
261,516
285,501
Cash, Cash Equivalents & STI
130,519
148,161
190,119
Accounts Receivable, Net
21,848
41,270
12,826
Inventories
68,906
69,692
81,326
Total Current Liabilities
68,211
78,719
49,265
Payables & Accruals
- -
- -
- -
ST Debt
247
160
- -
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-12.11%
15.71%
42.56%
Free Cash Flow
-8.43%
18.02%
-41.53%
Net Income, GAAP
-164.58%
-194.81%
-857.29%
Sales/Revenue/Turnover
113.62%
52.98%
105.49%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
8,229
19,728
9,346
32,974
70,277
2025
17,908
39,209
36,450
50,845
144,412
2026
88,893
72,293
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-134
32
-130
74.44
-157
2025
71
94
476.13
472.72
1,135
2026
1,047.93
720
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Full Time Employees
102
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Icheon-si South Korea
IPO Date
Aug 23, 2018
Website
iaptc.com
Business
VM Inc. is a South Korea-based semiconductor equipment manufacturing company specializing in the design, development, and production of plasma-based dry etching and wafer-processing systems for advanced integrated circuit fabrication. Founded in 2002 and headquartered in Icheon-si, Gyeonggi-do, South Korea, the company primarily serves global memory and logic device manufacturers. VM Inc. operates through its specialized semiconductor equipment business segment, offering a comprehensive product portfolio that includes conductor and polysilicon dry etchers under the proprietary LEO series, comprising the LEO NK I, LEO NK I-C, LEO WH, LEO WS, and LEO WSE systems engineered for ultra-fine patterning in DRAM and 3D NAND flash memory production; metal layer dry etching systems, including the NARDO-M, Selex 200, and Selex 300 platforms utilized for electrode and metal interconnect processing; dielectric and oxide etching solutions, including the TIGRIS and Selex 300 platforms developed for high-aspect-ratio contact and insulation layer fabrication; and auxiliary plasma-processing equipment, such as APIS 300 plasma doping systems, through-silicon via (TSV) etchers, light-emitting diode (LED) etchers, and plasma wafer sawing apparatus. In addition to primary manufacturing equipment, the company provides chamber modification, equipment retrofitting, spare parts distribution, process optimization, and comprehensive field engineering support services. The company conducts primary manufacturing and research operations in South Korea and supports semiconductor fabrication facilities across East Asia, notably in mainland China, alongside an international presence in the United States. In recent developments, the company officially rebranded and changed its corporate name from Adaptive Plasma Technology Corp. (APTC Co., Ltd.) to VM Inc. in March 2024 to reflect its broader technological scope and global market orientation. VM Inc. has recently secured multiple equipment supply contracts with primary strategic partner SK Hynix to support advanced 1b-nanometer DRAM transition and High Bandwidth Memory (HBM) production capacity, expanded commercialization efforts for its full-lineup etching solutions including oxide etching platforms, initiated infrastructure development for new facilities in the Yongin Semiconductor Cluster, and augmented its North American branch operations to target international foundry and non-memory semiconductor customers.