1. South Korea Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
Winpac, Inc.

Winpac, Inc.

KKRX:097800
2,770.00
KRW
-60.00
(-2.12%)
-520.06EPS
53.22BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
10,865.31
10,515.74
9,031.46
6,154.82
10,303.53
7,734.75
10,513.47
11,509.36
9,496.73
11,446.04
5,684.82
3,917.74
3,090.16
3,267.45
Basic EPS, GAAP
-2,139.04
-1,062.1
-1,685.13
-2,290.35
-1,558.59
168.91
997.75
538.15
-773.84
-117.84
-2,195.83
-1,585
-560
-520.06
Free Cash Flow per Basic Share
-3,348.16
-1,419.6
89.48
-633.85
98.36
-930.28
-2,099.91
-849.52
-1,924.67
-1,818.03
-1,299.01
-1,198.16
-550.27
-139.86
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
9,301.98
8,243.83
6,524.05
4,189.71
3,827.6
4,047.73
4,961.29
5,330.74
5,208.37
5,020.37
3,080.32
2,840.66
2,304.15
2,225.44
Tangible Book Value per Share
8,830.96
7,751.13
6,224.27
4,010.25
3,788.84
4,001.11
4,905.35
5,185.36
5,003.7
4,875.14
2,976.67
2,795.46
2,247.2
2,172
Basic Weighted Avg Shares
5
5
5
6
5
9
9
10
11
13
15
19
24
25
Sales/Revenue/Turnover
50,457
50,296
43,325
34,739
47,152
67,512
97,927
110,095
101,442
152,635
86,205
74,141
75,548
83,096
Operating Margin (%)
-16.73
0.18
-13.18
-27.65
-7.65
3.61
7.99
4.85
-6.35
1.26
-26.52
-31.39
-18.91
-13.92
Depreciation Expense
17,603
12,593
11,909
10,681
8,527
7,522
11,086
15,011
17,486
18,950
19,822
18,298
14,603
405
Net Income, GAAP
-9,933
-5,080
-8,084
-12,927
-7,133
1,474
9,293
5,148
-8,266
-1,571
-33,298
-29,995
-13,691
-13,226
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-19.69
-10.1
-18.66
-37.21
-15.13
2.18
9.49
4.68
-8.15
-1.03
-38.63
-40.46
-18.12
-15.92
Working Capital
-28,651
-30,698
-30,783
-36,671
-16,151
-25,996
-18,619
-33,081
-54,266
-43,330
-44,647
-47,530
-33,523
-32,095
LT Debt
5,900
6,667
3,333
- -
- -
- -
31,201
26,714
9,983
29,221
31,924
5,891
8,166
8,166
Total Equity
44,523
39,458
31,986
24,136
33,219
37,182
47,048
51,966
65,854
76,152
46,724
66,159
62,880
60,732
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
-22.4
-12.1
-22.63
-46.07
-24.87
4.19
22.07
10.4
-14.03
-2.21
-54.2
-53.14
-21.22
-21.29

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
47,080
46,416
43,336
LT Borrowings
10,401
8,125
8,166
LT Finance Leases
- -
41
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
27
27
27
Market Capitalization
74,502
70,408
53,216

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
31,257
25,851
24,490
Cash, Cash Equivalents & STI
9,943
3,455
615
Accounts Receivable, Net
9,919
9,339
10,513
Inventories
7,673
9,608
9,730
Total Current Liabilities
63,021
59,374
56,586
Payables & Accruals
- -
- -
- -
ST Debt
47,080
46,416
43,336
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
10.24%
8.07%
-4.96%
Free Cash Flow
-274.08%
25.32%
-40.67%
Net Income, GAAP
199.32%
322.61%
-54.36%
Sales/Revenue/Turnover
10.36%
-2.6%
1.9%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
22,640
20,423
16,330
15,247
74,141
2025
14,637
18,296
21,439
21,176
75,548
2026
22,185
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-416.38
-490
-330
-323.82
-1,585
2025
-117.51
-236.63
-79.26
-130.16
-560
2026
-83.25
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Dong-Ho Shin
Full Time Employees
395
Sector
Electronic technology
Industry
Semiconductors
Address
Yongin-si South Korea
IPO Date
Mar 7, 2013
Website
winpac.co.kr
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Business
Winpac, Inc. is a South Korea-based outsourced semiconductor assembly and test provider specializing in back-end packaging and testing solutions for memory and system semiconductors. Founded in 2002 and headquartered in Yongin-si, Gyeonggi-do, South Korea, the company operates as a key manufacturing partner for integrated device manufacturers and fabless design houses across South Korea and global markets. Winpac operates primarily as a subsidiary of ABOV Semiconductor Co., Ltd. The company's core product and service portfolio comprises comprehensive semiconductor packaging services; Fine-pitch Ball Grid Array packages; Multi-Chip Packages; embedded MultiMediaCard packages; Low-Power Double Data Rate memory packages; Quad Flat No-Lead and Dual Flat No-Lead packages; System-in-Package configurations; wafer-level Electrical Die Sorting testing; burn-in testing; and final package testing for high-speed dynamic random-access memory, NAND flash memory, microcontroller units, and specialized logic integrated circuits. In recent developments, Winpac underwent a major ownership and structural transition following its acquisition by ABOV Semiconductor Co., Ltd., creating an integrated supply chain connecting microcontroller chip design with dedicated back-end packaging and test infrastructure. In addition, the company has expanded its manufacturing and test capacities with upgraded automated assembly lines and high-frequency test platforms to support next-generation DDR5 memory, LPDDR5, and automotive-grade semiconductors. Winpac continues to execute a strategic operational expansion aimed at increasing its market share in non-memory and system integrated circuit packaging while maintaining its long-term packaging partnerships with leading domestic memory semiconductor manufacturers.