DIT Corp.

DIT Corp.

KKRX:110990
14,100.00
KRW
-60.00
(-0.42%)
2,379.87EPS
8.42P/E
372.70BMarket Cap
Nov 18Next Earn
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
4,688.14
5,679.18
4,630.25
6,431.65
1,565.57
4,179.74
7,282.1
5,847.74
6,330.87
5,840.27
7,938.99
Basic EPS, GAAP
659
733
455
713
81
-80
508
719
1,570
1,644
2,381.49
Free Cash Flow per Basic Share
-1,033.35
1,227.99
410.32
116.07
63.32
-493.65
422.07
38.07
1,988.81
1,310.21
1,489.37
Dividend per Share
- -
- -
91.21
120.78
201.22
- -
- -
299.49
179.23
379.51
- -
Book Value per Share
5,895.66
6,482.31
8,765.17
9,381.06
9,299.57
9,224.44
9,727.06
10,144.59
11,536.33
12,758.4
13,944.6
Tangible Book Value per Share
5,868.6
6,454.71
8,701.34
9,314.48
9,239.35
9,171.26
9,684.28
10,107.43
11,489.42
12,711.19
13,893.9
Basic Weighted Avg Shares
15
15
17
18
18
18
18
18
18
18
19
Sales/Revenue/Turnover
70,996
85,994
76,871
118,761
28,593
76,092
132,875
107,061
116,655
107,910
147,254
Operating Margin (%)
12.03
13.19
7.54
11.08
-6.76
-7.75
4.17
8.07
20.65
21.37
27.04
Depreciation Expense
881
868
982
1,851
1,645
1,496
1,511
1,260
1,238
1,225
1,250
Net Income, GAAP
9,980
11,099
7,554
13,166
1,479
-1,456
9,269
13,164
28,930
30,376
44,172
Effective Tax Rate (%)
24.77
15.02
9.01
9.94
- -
- -
21.27
10.31
13.97
- -
6.67
Profit Margin (%)
14.06
12.91
9.83
11.09
5.17
-1.91
6.98
12.3
24.8
28.15
30
Working Capital
71,476
84,558
120,934
130,132
124,739
120,793
124,118
143,405
167,709
182,984
206,958
LT Debt
- -
- -
- -
52
110
163
44
146
181
150
92
Total Equity
111,428
122,516
162,905
172,375
169,529
168,250
177,782
186,127
212,880
237,157
259,207
Return on Invested Capital (%)
- -
8.18
3.68
7.04
- -
- -
2.51
4.23
10.15
- -
15.17
Return on Capital (%)
- -
9.51
6.14
8.93
- -
- -
6.28
7.47
14.48
- -
18.39
Return on Common Equity (%)
- -
9.49
5.29
7.85
0.87
-0.86
5.36
7.23
14.5
13.5
18.41

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
328
318
276
LT Borrowings
- -
- -
- -
LT Finance Leases
150
141
92
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
19
19
19
Market Capitalization
270,832
341,839
372,696

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
211,183
234,324
245,035
Cash, Cash Equivalents & STI
175,276
188,530
195,244
Accounts Receivable, Net
5,861
14,753
20,980
Inventories
17,607
16,459
18,694
Total Current Liabilities
28,199
42,694
38,077
Payables & Accruals
- -
- -
- -
ST Debt
328
318
276
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
7.08%
11.4%
Free Cash Flow
- -
793.97%
-33.94%
Net Income, GAAP
- -
-153.63%
5%
Sales/Revenue/Turnover
- -
44.55%
-7.5%
Total Cash Common Dividend
- -
- -
112.33%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
20,190
30,739
16,488
49,238
116,655
2025
21,644
29,073
30,409
26,785
107,910
2026
48,460
41,601
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
263
419
217
676.97
1,570
2025
328
464
486
366.59
1,644
2026
793.59
734
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
179.23
2025
- -
- -
- -
- -
379.51
2026
- -
- -
- -
- -
- -

Company Description

CEO
Jong-Cheol Park
Full Time Employees
237
Sector
Electronic technology
Industry
Computer peripherals
Address
Hwaseong-si South Korea
IPO Date
Aug 7, 2018
Business
DIT Corp. is a South Korea-based technology company that specializes in the development, manufacturing, and distribution of advanced automated optical inspection (AOI) systems, artificial intelligence (AI) vision solutions, and precision laser processing equipment for the semiconductor, display, secondary battery, and automotive industries. Founded in September 2005 and headquartered in Hwaseong, South Korea, with research and development operations centered in Suwon, the company provides automated manufacturing and quality control solutions to high-tech manufacturers across South Korea, mainland China, and other key Asian technology markets. The company operates through three principal product and technology segments: Laser Solutions, AOI and Inspection Systems, and AI Image Processing Software. Its Laser Solutions division manufactures advanced semiconductor laser annealing systems engineered for wafer surface defect recovery, dopant activation, contact silicidation, and thermal management in High Bandwidth Memory (HBM) and power semiconductors; precision laser cutting machines used for ultra-thin glass, semiconductor wafer, and optical film processing; and high-precision laser repair systems utilized to correct pixel defects, panel irregularities, and photomask imperfections in flat-panel display manufacturing. Its AOI and Inspection Systems division offers display optical inspection platforms for rigid and flexible OLED, micro-LED, mother glass, cell, and module production; wafer geometry and surface measurement systems designed to detect micro-cracks, edge chipping, and particle contamination; secondary battery automated visual inspection (AVI) equipment for electrode, separator, and cell assembly verification; and specialized industrial surface and mold inspection systems for automotive parts. Its AI Solutions division provides proprietary deep learning and machine learning algorithms, roll-based image processing engines, and automated defect classification software integrated directly into production lines to optimize manufacturing yields. In recent years, DIT Corp. has undergone a significant strategic transformation by pivoting its core business toward front-end semiconductor capital equipment. Following the co-development of proprietary laser annealing technology with SK Hynix, the company secured successive mass-production supply agreements for HBM3E, HBM4, and advanced DRAM manufacturing lines, resulting in semiconductor laser equipment becoming the company's primary revenue driver. DIT Corp. has also expanded its technical capabilities into laser solutions for next-generation hybrid bonding and high-layer 3D NAND fabrication, while broadening its commercial exposure to silicon nitride (Si3N4) substrates, electric vehicle battery inspection, and advanced packaging applications.