RAM TECHNOLOGY Co., Ltd.

RAM TECHNOLOGY Co., Ltd.

KKRX:171010
2,395.00
KRW
-15.00
(-0.62%)
-557.97EPS
44.33BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
5,930.95
2,094.81
2,325.79
2,185.83
2,138.6
2,849.89
3,774.78
3,207.05
3,642.81
4,822.72
3,040.33
3,115.51
2,984.55
3,064.92
Basic EPS, GAAP
288.46
-319.59
-181
-286
81
131
276
187
237
436
-203
-179
-585
-557.97
Free Cash Flow per Basic Share
-1,191.83
-1,071.78
-58.81
234.11
124.63
121.64
248.55
-218.64
84.25
-154.42
-861.84
-867.63
-499.28
-638.61
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
2,228.44
1,925.08
1,775.63
1,499.01
1,550.11
1,650.45
3,003.67
3,292.28
3,209.77
3,722.49
3,420.73
3,356.55
2,778.06
2,867.32
Tangible Book Value per Share
2,077.5
1,762.45
1,614.81
1,372.82
1,432
1,529.29
2,863.99
3,155.13
3,086.38
3,606.53
3,309.7
3,239.4
2,649.16
2,734.3
Basic Weighted Avg Shares
7
11
11
11
11
11
12
13
13
14
14
14
14
14
Sales/Revenue/Turnover
42,974
23,845
26,438
24,863
24,427
32,617
43,411
42,759
48,583
67,023
42,976
44,501
42,682
43,824
Operating Margin (%)
8.17
-11.79
-3.28
-8.77
4.9
6.52
10.35
6.11
9.21
10.3
-6.87
-3.71
-2.24
-1.47
Depreciation Expense
2,696
3,173
3,621
3,336
3,075
2,808
2,433
2,481
2,376
2,166
2,254
3,264
3,240
3,046
Net Income, GAAP
2,090
-3,638
-2,057
-3,253
925
1,499
3,174
2,493
3,161
6,059
-2,869
-2,557
-8,366
-7,978
Effective Tax Rate (%)
11.12
- -
- -
- -
- -
- -
11.24
- -
8.25
18.94
- -
- -
- -
- -
Profit Margin (%)
4.86
-15.26
-7.78
-13.08
3.79
4.6
7.31
5.83
6.51
9.04
-6.68
-5.75
-19.6
-18.21
Working Capital
-4,159
-10,579
-12,958
-13,782
-12,560
-11,506
12,689
7,309
1,055
6,708
924
6,258
172
2,143
LT Debt
6,804
12,254
10,181
9,107
6,572
4,874
9,277
8,227
- -
1,200
9,000
23,554
30,004
32,684
Total Equity
25,366
21,913
20,211
17,063
17,644
18,916
35,608
39,064
43,195
51,616
48,588
47,994
39,723
40,999
Return on Invested Capital (%)
7.03
- -
- -
- -
- -
- -
7.35
- -
6.56
7.95
- -
- -
- -
- -
Return on Capital (%)
7.35
- -
- -
- -
- -
- -
7.44
- -
6.59
10.18
- -
- -
- -
- -
Return on Common Equity (%)
10
-15.39
-9.77
-17.45
5.33
8.2
11.83
6.83
7.78
12.81
-5.73
-5.29
-19.08
-17.97

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
29,248
27,574
30,138
LT Borrowings
30,429
30,004
32,684
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
14
14
14
Market Capitalization
61,771
55,765
44,326

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
35,331
29,998
35,420
Cash, Cash Equivalents & STI
17,309
14,647
17,673
Accounts Receivable, Net
3,198
3,187
3,717
Inventories
13,310
10,822
12,232
Total Current Liabilities
31,941
29,826
33,277
Payables & Accruals
- -
- -
- -
ST Debt
29,248
27,574
30,138
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
9.87%
1.15%
-17.23%
Free Cash Flow
-64.63%
-0.51%
-42.38%
Net Income, GAAP
26.94%
37.49%
227.21%
Sales/Revenue/Turnover
7.26%
3.03%
-4.09%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
11,677
11,913
10,980
9,931
44,501
2025
10,519
10,779
10,675
10,709
42,682
2026
11,662
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-51
-5
-47
-76.93
-179
2025
-14
-9.02
-35.19
-526.52
-585
2026
12.75
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Jun-Bong Gil
Full Time Employees
86
Sector
Electronic technology
Industry
Semiconductors
Address
Yongin-si South Korea
IPO Date
Nov 18, 2013
Business
RAM TECHNOLOGY Co., Ltd. is a South Korea-based specialty chemicals company that manufactures and distributes high-purity process chemical materials for the semiconductor, display, advanced electronics packaging, secondary battery, and solar energy industries. Founded in October 2001 and headquartered in Yongin-si, Gyeonggi-do, South Korea, the company operates dedicated chemical manufacturing and research facilities in Geumsan-gun and Gongju-si, Chungcheongnam-do, serving domestic and international electronics manufacturers. The company's core product portfolio is organized across several electronic material categories: wet etchants, including high-purity hydrofluoric acid, buffered oxide etchants, and phosphoric acid formulations utilized for selective oxide, nitride, and substrate removal; photoresist strippers, including aluminum and copper strippers designed to eliminate photoresist layers and organic residues during photolithography; post-etch cleaning and rinsing solutions engineered to decontaminate surface particles and metallic impurities; secondary battery materials, including electronic-grade N-Methyl-2-pyrrolidone solvents, binders, and chemical recycling systems; and specialized chemical purification and recovery services. In recent strategic developments, RAM TECHNOLOGY has expanded and automated its Geumsan production complex into a smart factory facility, increasing its hydrofluoric acid production capacity by approximately 70% and installing dedicated manufacturing lines for high-bandwidth memory, Through-Silicon Via, and quantum-controlled ultra-high-purity phosphoric acid purification. In addition, the company has broadened its technological footprint into next-generation artificial intelligence chip packaging by developing and patenting proprietary hydrofluoric acid-based Through Glass Via interposer hole etching chemicals for glass substrate semiconductor packaging, while concentrating its capital investments at its Geumsan hub to accelerate commercialization with major advanced packaging and electronic component customers.