Coset, Inc.
KKRX:1893502,080.00
KRW
+50.00
(+2.46%)
ISIN
KR7189350002
Return %
Stock
S&P 500
1Y
56.39
14.39
3Y
-5.67
81.42
5Y
-18.59
68.62
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.Company Description
- CEO
- Chi-Hyung Oh
- Full Time Employees
- 78
- Sector
- Producer manufacturing
- Industry
- Electrical products
- Address
- Gwangju South Korea
- IPO Date
- Dec 24, 2013
- Website
- coset.com
- Similar Companies
- Business
- Coset, Inc. is a South Korea-based technology company that designs, develops, and manufactures high-precision optical communication components, laser diode modules, and advanced photonics packaging solutions. Founded in 1999 and headquartered in Gwangju, South Korea, the company specializes in micron-level optical alignment and micro-packaging technologies for telecommunications, data communications, industrial manufacturing, medical systems, and defense applications. Coset operates primarily through an export-driven business model, distributing its products to telecommunication equipment vendors, cloud infrastructure providers, and industrial equipment manufacturers across North America, Europe, and the Asia-Pacific region. The company's core product portfolio encompasses optical communication components, including 980 nm pump laser diode modules in cooled 14-pin butterfly and uncooled 8-pin mini-DIL packages for optical amplifiers; optical sub-assemblies, comprising transmitter optical sub-assemblies (TOSA), receiver optical sub-assemblies (ROSA), and bidirectional optical sub-assemblies (BOSA); high-speed optical transceivers, including 100 Gbps QSFP28 modules (LR4, FR4, and ER4-Lite) and high-density 400GbE-ready optical engines; precision optical components, including lensed fibers, fiber assemblies, and hermetic packaging for semiconductor diode chips; high-power industrial laser modules for precision material processing and smart manufacturing; specialized medical laser light sources for diagnostic equipment and minimally invasive surgical devices; and high-reliability broadband optical sources and sensing modules for defense applications. In addition to standard product lines, Coset offers end-to-end original design manufacturing (ODM) and custom photonics packaging services, encompassing opto-electrical design, rapid prototyping, laser welding, optical coupling, and high-volume automated manufacturing compliant with Telcordia GR-468 CORE reliability standards. In recent developments, Coset has expanded its strategic focus toward high-speed optical interconnects and next-generation photonics solutions to address increasing bandwidth demands in artificial intelligence data centers and telecommunications networks, scaling up the commercial deployment of its 400GbE-compatible optical parts and ultra-compact sub-assemblies. The company has also accelerated the diversification of its proprietary packaging platform into non-telecom sectors, broadening development pipelines and commercial partnerships in defense-grade optical sensors, medical laser systems, and high-power industrial manufacturing tools. Operationally, Coset achieved a financial turnaround driven by expanding international shipments and reinforced its corporate governance structure following its 2026 annual general meeting under the leadership of Chief Executive Officer Chi-Hyung Oh, while continuing to invest in automated manufacturing infrastructure and global supply chain partnerships.