HAESUNG DS Co., Ltd.

HAESUNG DS Co., Ltd.

KKRX:195870
44,050.00
KRW
-1,750.00
(-3.82%)
3,151.78EPS
22.37P/E
1.20TMarket Cap
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
13,312.01
16,400.42
17,201.06
19,114.5
21,367.57
22,427.71
26,983.52
38,552.6
49,371.67
39,541.77
35,472.54
38,428.97
44,601.11
Basic EPS, GAAP
1,630
979
1,175
1,410
1,226
1,078
1,764
4,192
9,376
4,966
3,453
1,401
3,151.78
Free Cash Flow per Basic Share
-90.63
1,163.87
-911.15
-767.05
401.15
255.1
383.37
1,709.54
6,850.45
2,653.32
-5,804.14
-3,145.87
376.47
Dividend per Share
- -
- -
- -
249.91
299.97
299.9
349.98
450.01
599.97
899.95
900.06
799.87
- -
Book Value per Share
6,092.81
6,995.9
9,477.47
10,643.75
11,548.88
12,266.95
13,637.58
17,312.64
26,311.49
30,297.08
32,722.15
33,198.22
33,993.45
Tangible Book Value per Share
6,025.69
6,914.45
9,326.94
10,473.59
11,396.63
12,117.41
13,450.74
16,955.58
25,129.84
28,926.01
30,820.44
31,822.86
32,713.85
Basic Weighted Avg Shares
12
15
16
17
17
17
17
17
17
17
17
17
17
Sales/Revenue/Turnover
165,198
246,043
276,196
325,061
363,290
381,400
458,746
655,373
839,358
672,245
602,994
653,397
758,274
Operating Margin (%)
6.01
7.64
9.35
10.41
7.37
7.09
9.49
13.17
24.35
15.25
9.43
7.12
9.73
Depreciation Expense
5,433
9,530
9,188
10,207
17,335
23,247
27,738
32,941
39,029
44,669
50,204
57,680
60,085
Net Income, GAAP
20,228
14,687
18,867
23,978
20,844
18,332
29,990
71,262
159,400
84,426
58,697
23,821
53,584
Effective Tax Rate (%)
8.13
17.53
18.85
18.69
15.46
16.61
20.58
20.63
22.36
20.25
12.33
26.89
25.43
Profit Margin (%)
12.24
5.97
6.83
7.38
5.74
4.81
6.54
10.87
18.99
12.56
9.73
3.65
7.07
Working Capital
45,122
28,259
44,090
24,019
46,780
39,039
54,004
101,114
174,851
212,134
120,324
206,591
240,436
LT Debt
33,429
32,286
33,143
15,000
39,500
25,819
28,093
22,596
12,589
37,376
31,076
128,807
126,607
Total Equity
103,578
118,930
161,351
181,091
196,362
208,538
231,839
294,315
447,295
515,050
556,277
564,370
577,889
Return on Invested Capital (%)
- -
8.85
10.35
11.43
8.63
8.21
11.38
19.26
33.57
14.1
7.74
4.59
7.15
Return on Capital (%)
- -
10.1
10.56
10.81
8.89
7.48
10.46
21.04
35.95
15.77
9.62
3.91
7.77
Return on Common Equity (%)
- -
13.2
13.47
14.02
11.05
9.06
13.62
27.09
42.99
17.55
10.96
4.25
9.56

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
93,293
97,657
117,084
LT Borrowings
119,826
123,867
117,833
LT Finance Leases
8,981
8,953
8,774
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
17
17
17
Market Capitalization
946,900
794,750
1,198,500

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
386,156
414,994
457,694
Cash, Cash Equivalents & STI
108,305
109,528
113,837
Accounts Receivable, Net
136,379
144,103
161,441
Inventories
132,397
151,098
169,787
Total Current Liabilities
179,564
198,639
217,259
Payables & Accruals
- -
- -
- -
ST Debt
93,293
97,657
117,084
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
17.72%
20.71%
1.45%
Free Cash Flow
-11.22%
44.17%
-45.79%
Net Income, GAAP
21.84%
24.87%
-59.42%
Sales/Revenue/Turnover
11.61%
9.82%
8.36%
Total Cash Common Dividend
- -
- -
-11.11%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
154,904
153,470
149,423
145,196
602,994
2025
137,478
157,383
178,589
179,947
653,397
2026
188,652
211,086
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,147
1,235
351
720.57
3,453
2025
34
-26
827.83
565.02
1,401
2026
636.83
1,122
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
900.06
2025
- -
- -
- -
- -
799.87
2026
- -
- -
- -
- -
- -

Company Description

CEO
Byung-Hak Cho
Full Time Employees
1,354
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Haesung 2 Building Changwon SG South Korea 06178
IPO Date
Jun 24, 2016
Business
HAESUNG DS Co., Ltd. manufactures and sells semiconductor substrates and components, including lead frames by stamping and etching methods for automotive, mobile device, personal computer, and consumer electronics applications; PCB substrates that electrically connect memory chips such as flash memory, mobile DRAM, and graphic DRAM to mainboards; tape substrates for smart cards including SIM cards, credit cards, and e-passports; and graphene materials for energy, sensor, bio, military, ink, and display industries. The company, founded in 1984 as a spin-off from Samsung Techwin and part of Haesung Group since 2014, is headquartered in Changwon, South Korea, with a subsidiary in the Philippines established through the 2022 acquisition of PSMC Philippines to expand lead frame production for power semiconductors amid growing automotive demand. HAESUNG DS operates primarily in South Korea and exports over 95% of its products internationally to global semiconductor leaders, holding a top-three position in the worldwide lead frame market. Recent developments include the development of super-fine pitch stamped QFP tools with 110μm inner lead pitch in 2024 to enter high-integration markets like Japan; selection as lead company for a 9.7 billion KRW national R&D project in 2025 to develop an AI platform for real-time carbon footprint management; receipt of Texas Instruments' 2024 Supplier Excellence Award, its second from TI; publication of its 2024 Sustainability Report outlining carbon neutrality by 2050 and ESG leadership goals by 2027; and participation in KPCA Show 2025 showcasing its three core substrate technologies. The company maintains consistent 'A' ESG ratings from KCGS, implements ERP systems for operational efficiency, and pursues CSR initiatives such as partnerships with World Share for Philippine school support.