HAESUNG DS Co., Ltd. manufactures and sells semiconductor substrates and components, including lead frames by stamping and etching methods for automotive, mobile device, personal computer, and consumer electronics applications; PCB substrates that electrically connect memory chips such as flash memory, mobile DRAM, and graphic DRAM to mainboards; tape substrates for smart cards including SIM cards, credit cards, and e-passports; and graphene materials for energy, sensor, bio, military, ink, and display industries. The company, founded in 1984 as a spin-off from Samsung Techwin and part of Haesung Group since 2014, is headquartered in Changwon, South Korea, with a subsidiary in the Philippines established through the 2022 acquisition of PSMC Philippines to expand lead frame production for power semiconductors amid growing automotive demand. HAESUNG DS operates primarily in South Korea and exports over 95% of its products internationally to global semiconductor leaders, holding a top-three position in the worldwide lead frame market. Recent developments include the development of super-fine pitch stamped QFP tools with 110μm inner lead pitch in 2024 to enter high-integration markets like Japan; selection as lead company for a 9.7 billion KRW national R&D project in 2025 to develop an AI platform for real-time carbon footprint management; receipt of Texas Instruments' 2024 Supplier Excellence Award, its second from TI; publication of its 2024 Sustainability Report outlining carbon neutrality by 2050 and ESG leadership goals by 2027; and participation in KPCA Show 2025 showcasing its three core substrate technologies. The company maintains consistent 'A' ESG ratings from KCGS, implements ERP systems for operational efficiency, and pursues CSR initiatives such as partnerships with World Share for Philippine school support.