APACT Co., Ltd.
KKRX:2004709,310.00
KRW
+690.00
(+8.00%)
ISIN
KR7200470003
Return %
Stock
S&P 500
1Y
77.33
14.20
3Y
208.79
81.12
5Y
131.21
68.34
Capital Structure
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•
in mil. unless spec.Working Capital
KRW
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Seong-Dong Lee
- Full Time Employees
- 440
- Sector
- Commercial services
- Industry
- Miscellaneous commercial services
- Address
- Anseong-si South Korea
- IPO Date
- Dec 26, 2014
- Website
- apact.co.kr
- Similar Companies
- Business
- APACT Co., Ltd. is a South Korea-based outsourced semiconductor assembly and test (OSAT) service provider specializing in comprehensive back-end manufacturing solutions for memory and system semiconductors. Founded in 2007 and headquartered in Eumseong-gun, Chungcheongbuk-do, South Korea, the company operates across semiconductor testing, packaging, and engineering service segments. APACT provides turnkey post-fabrication services to integrated device manufacturers, fabless design houses, and foundries across domestic and international semiconductor markets. The company's core product and service portfolio includes semiconductor wafer testing; final package testing; burn-in testing; module testing; tape-and-reel services; and custom test hardware design. In memory semiconductors, APACT delivers testing solutions for dynamic random-access memory (DRAM), including DDR4, DDR5, low-power DDR (LPDDR4/5), and graphics DDR (GDDR); high-bandwidth memory (HBM); NAND flash storage; and solid-state drives (SSDs). In system semiconductors and non-memory devices, the company offers testing and screening for microcontrollers (MCUs), power management integrated circuits (PMICs), display driver ICs (DDIs), CMOS image sensors (CIS), and automotive semiconductors. Its packaging operations provide substrate-based packaging, wafer-level packaging, system-in-package (SiP) solutions, and multi-chip module assemblies. In addition, APACT offers auxiliary engineering services, including test program development, probe card and load board design, thermal characterization, failure analysis, and reliability testing adhering to international standards such as AEC-Q100 for automotive electronics. In recent strategic developments, APACT has transformed from a dedicated memory testing specialist into a full-turnkey OSAT provider through the acquisition of the semiconductor packaging business division of ATsemicon Co., Ltd., integrating full assembly and packaging capabilities alongside its testing infrastructure. To reduce cyclical dependency on commodity memory markets, the company has actively expanded its non-memory and system IC testing capacity, deploying high-speed automated test equipment for automotive microcontrollers and industrial power chips. Furthermore, APACT has made substantial capital expenditures to scale high-bandwidth memory and high-performance DDR5 testing capacity across its manufacturing facilities in South Korea, securing qualifications with tier-one global semiconductor manufacturers and broadening its client base among domestic and overseas fabless design companies.