Genesem, Inc.
KKRX:2171908,340.00
KRW
+220.00
(+2.71%)
ISIN
KR7217190008
Return %
Stock
S&P 500
1Y
41.04
14.39
3Y
3.82
81.42
5Y
35.24
68.62
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- Full Time Employees
- 159
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Inchon South Korea
- IPO Date
- Sep 25, 2015
- Website
- genesem.com
- Similar Companies
- Business
- Genesem, Inc. is a South Korea-based company primarily engaged in the development, manufacture, and distribution of semiconductor backend processing, packaging automation, and laser application equipment. Founded in 2000 and headquartered in Incheon, South Korea, the company designs and supplies precision automated equipment utilized across post-fabrication semiconductor manufacturing, advanced packaging, and quality testing workflows. Genesem operates across specialized product categories, offering a portfolio that includes: laser processing equipment such as semiconductor strip laser markers, mold laser markers, wafer laser markers, laser cutting systems, and laser deflash machinery; pick-and-place and sorting systems comprising high-speed die sorters, flip chip handlers, and reel-to-reel automated handlers; post-saw singulation and automation systems including saw singulation handlers, wafer wash-and-dry units, and substrate transfer systems; inspection and test handling solutions encompassing automated optical inspection vision handlers, tray-to-tray inspection handlers, and final test sorters; and advanced packaging solutions including electromagnetic interference shield handlers, wafer mounters, and demounters. The company caters to global integrated device manufacturers and outsourced semiconductor assembly and test providers across South Korea, China, Taiwan, the United States, and Southeast Asia. In recent developments, Genesem has expanded its product offerings to support advanced 2.5D and 3D packaging architectures and High-Bandwidth Memory production, securing major supply contracts with leading semiconductor packaging providers for next-generation laser marking and high-precision automation systems. The company has also broadened its proprietary electromagnetic interference shielding equipment lineup for artificial intelligence processors and automotive semiconductors, while expanding its cleanroom manufacturing capacity and research and development facilities in Incheon to accommodate growing international demand.