YMT Co., Ltd.
KKRX:2513707,370.00
KRW
-200.00
(-2.64%)
ISIN
KR7251370003
Return %
Stock
S&P 500
1Y
-44.12
14.39
3Y
-31.31
81.42
5Y
-64.31
68.62
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.Company Description
- Full Time Employees
- 142
- Sector
- Process industries
- Industry
- Chemicals: specialty
- Address
- Inchon South Korea
- IPO Date
- Apr 27, 2017
- Website
- ymtechnology.com
- Similar Companies
- Business
- YMT Co., Ltd. is a South Korea-based specialty chemicals and advanced materials company that develops, manufactures, and supplies high-performance chemical solutions and functional materials for printed circuit boards, semiconductor packaging, and display manufacturing industries. The company operates through three primary business divisions: Chemical Materials, Advanced Materials, and Plating Equipment and Services. Its core product and service portfolio comprises final surface finishing chemicals, including electroless nickel immersion gold, electroless nickel electroless palladium immersion gold, immersion tin, immersion silver, and organic solderability preservatives; PCB pre-treatment and process chemicals, including chemical copper plating formulations, acid cleaners, soft etchants, micro-etching solutions, and direct electroplating copper additives; semiconductor wet process chemicals, including post-dry etch cleaners, photoresist strippers, and wafer surface cleaning agents; advanced functional materials, featuring Nanotus ultra-thin copper foil with carrier technology for high-density interconnects, flexible printed circuit boards, and semiconductor lead frames, as well as electromagnetic interference shielding films; and automated process equipment, including smart factory wet chemical analyzers, dosing systems, and outsourced substrate plating processing services. The company caters to leading printed circuit board fabricators, semiconductor packaging providers, outsourced semiconductor assembly and test vendors, and consumer electronics manufacturers across South Korea, China, Vietnam, Taiwan, and the United States. In recent developments, YMT has accelerated its strategic expansion into next-generation artificial intelligence semiconductor packaging by developing proprietary Through Glass Via electroplating chemical formulations and metallization technologies for glass core substrates, demonstrating large-area glass substrate prototypes and offering dedicated outsourced plating processing services in partnership with its subsidiary, YPT Co., Ltd. Furthermore, the company secured commercial qualification to supply its proprietary electroless nickel electroless palladium immersion gold surface treatment solutions to major Taiwanese IC substrate fabricators for artificial intelligence graphics processing units and high-performance computing boards, while expanding capacity and distribution footprints across its subsidiaries in Greater China and Vietnam. Founded in 1999, YMT Co., Ltd. is headquartered in Incheon, South Korea, and maintains key operating subsidiaries including VINA YMT Co., Ltd. and YPT Co., Ltd.