- CEO
- Hyeong-Cheol Kim
- Full Time Employees
- 160
- Sector
- Health technology
- Industry
- Medical specialties
- Address
- Seongnam-si South Korea
- IPO Date
- Dec 2, 2016
- Business
- XAVIS Co., Ltd. is a South Korea-based technology company primarily engaged in the research, design, and manufacturing of non-destructive X-ray inspection systems and automated machine vision solutions. Founded in 2002 and headquartered in Seongnam-si, Gyeonggi-do, South Korea, the company develops specialized inspection equipment across two primary business divisions: industrial inspection systems (Xscan) and food and pharmaceutical inspection systems (Fscan). Its industrial product portfolio includes automated X-ray inspection (AXI) systems and computed tomography (CT) equipment for secondary battery manufacturing across pouch, prismatic, and cylindrical form factors; semiconductor and microelectronics inspection platforms for high-bandwidth memory (HBM), flip-chip packages, and wafer-level packaging; automated inline and offline surface mount technology (SMT) and printed circuit board (PCB) inspection systems; and heavy-duty inspection machinery for automotive parts and metal die-casting quality assurance. Its food and pharmaceutical offerings consist of inline X-ray inspection systems designed to detect foreign contaminants such as metals, glass, stone, bone fragments, and high-density plastics, alongside automated quality control functions for defect detection, missing component verification, fill-level monitoring, and package seal inspection. The company also supplies proprietary image processing software, technical support, and equipment maintenance services. XAVIS distributes its products domestically and internationally across North America, Europe, and Asia, operating through international subsidiaries and partner networks in markets including China, Vietnam, and Japan. In recent developments, XAVIS has formally amended its corporate objectives to incorporate artificial intelligence software and hardware platforms, integrating deep learning algorithms into its core vision and inspection software to enhance defect identification accuracy and speed. The company has expanded its secondary battery solutions with proprietary rotary optics-based CT inspection systems engineered for energy storage systems (ESS) and next-generation 4680 cylindrical batteries, while launching advanced 2.5D laminography inspection platforms such as the Xscan-9800T25. Additionally, XAVIS has entered the advanced semiconductor packaging sector by developing inspection equipment for Through Glass Via (TGV) and Co-Packaged Optics (CPO) glass substrates utilized in artificial intelligence computing architectures, contributing to significant growth in its industrial inspection order backlog.