C&G HI Tech Co., Ltd.

C&G HI Tech Co., Ltd.

KKRX:264660
12,290.00
KRW
-160.00
(-1.29%)
2,035.25EPS
6.36P/E
126.41BMarket Cap
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
103,295.84
7,933.98
12,928.3
5,244
15,323.12
14,211.46
12,384.51
23,348.83
19,383.96
16,383.15
20,873.31
17,561.56
Basic EPS, GAAP
8,053.62
983.73
1,420.45
590.14
1,403.78
1,162.63
607.92
2,041.58
1,492.08
746
2,078
2,108.69
Free Cash Flow per Basic Share
8,108.97
1,673.08
-241.6
58.89
2,990.48
192.51
-2,712.37
1,990.68
1,247.92
-465.81
834.27
-1,323.52
Dividend per Share
980.32
80.39
47.1
27.34
99.97
150.34
346.51
196.84
431.95
390.83
99.24
-0.06
Book Value per Share
1,657.76
2,586.99
4,428
6,590.14
7,860.73
8,802.79
9,434.69
11,195.88
12,324.45
12,938.98
15,198.04
15,593.99
Tangible Book Value per Share
1,657.3
2,586.97
4,428
6,539.95
7,736.81
8,679.07
9,287.72
11,056.92
12,184.25
12,813.93
15,068.59
15,474.83
Basic Weighted Avg Shares
- -
6
6
17
8
8
8
8
9
9
9
9
Sales/Revenue/Turnover
47,346
44,345
75,191
88,261
128,842
119,183
101,403
192,781
166,726
151,188
196,194
165,569
Operating Margin (%)
9.5
14.66
13.6
13.68
11.24
10.01
7.23
13.19
7.64
8.56
12.61
14.68
Depreciation Expense
572
436
450
542
660
668
767
1,363
1,826
1,944
2,130
2,084
Net Income, GAAP
3,691
5,498
8,261
9,932
11,803
9,750
4,978
16,856
12,834
6,884
19,532
19,881
Effective Tax Rate (%)
17.56
20.47
21.14
22.62
19.67
15.89
31.8
19.19
12.11
26.6
21.85
22.17
Profit Margin (%)
7.8
12.4
10.99
11.25
9.16
8.18
4.91
8.74
7.7
4.55
9.96
12.01
Working Capital
5,700
10,995
21,402
49,705
59,942
55,026
60,130
76,164
62,310
74,504
88,721
84,958
LT Debt
56
37
19
- -
30
161
14,334
18,935
3,787
8,369
3,721
1,665
Total Equity
9,727
15,180
25,983
56,507
67,401
72,792
77,244
93,360
111,006
120,690
143,157
146,887
Return on Invested Capital (%)
- -
35.58
36.03
21.79
18.25
14.03
5.97
19.54
9.24
7.01
12.47
12.69
Return on Capital (%)
- -
40.37
39.31
24.07
19.04
13.89
6.42
17.3
10.79
5.11
12.8
13.52
Return on Common Equity (%)
- -
44.15
40.14
24.08
19.05
13.91
6.64
19.76
12.56
5.94
14.81
14.57

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
13,964
3,909
3,872
LT Borrowings
3,424
3,509
1,418
LT Finance Leases
297
242
247
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
9
9
9
Market Capitalization
149,769
150,617
126,409

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
138,178
130,212
116,186
Cash, Cash Equivalents & STI
64,633
57,624
50,934
Accounts Receivable, Net
11,438
6,152
14,572
Inventories
30,253
51,310
29,697
Total Current Liabilities
49,458
47,717
31,228
Payables & Accruals
- -
- -
- -
ST Debt
13,964
3,909
3,872
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
34.52%
14.64%
18.62%
Free Cash Flow
10.24%
-421.35%
-282.42%
Net Income, GAAP
42.41%
60.64%
183.72%
Sales/Revenue/Turnover
20.12%
16.42%
29.77%
Total Cash Common Dividend
- -
26.77%
-74.14%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
35,273
49,392
23,113
43,411
151,188
2025
80,890
39,141
20,454
55,708
196,194
2026
17,106
72,301
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
159.41
425.74
-306.93
461.95
746
2025
475
199
654
753.07
2,078
2026
101.52
600
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
390.83
2025
- -
- -
- -
-0.06
99.24
2026
- -
- -
- -
- -
- -

Company Description

Full Time Employees
200
Sector
Electronic technology
Industry
Semiconductors
Address
Anseong-si South Korea
IPO Date
Jan 25, 2018
Business
C&G HI Tech Co., Ltd. is a South Korea-based technology company primarily engaged in the development, manufacturing, and distribution of high-purity chemical delivery systems and specialized manufacturing equipment for the semiconductor, flat panel display, and advanced electronics industries. Founded in 2002 and headquartered in Anseong, Gyeonggi-do, South Korea, the company operates across specialized business segments dedicated to semiconductor fabrication equipment, chemical infrastructure, environmental reclamation solutions, and next-generation packaging materials. The company's core product and service portfolio comprises chemical central supply systems (CCSS), including automated chemical quick coupler (ACQC) units, automated mixing and blending systems, and precision chemical dispensing equipment; chemical reclamation and environmental systems, including sulfuric acid and hydrogen peroxide mixture (SPM) recycling equipment, copper reclamation apparatus, and chemical waste treatment platforms; functional water generation systems, encompassing dissolved ozone water generation equipment and hydrogen water supply units; semiconductor and display sub-fab automation solutions, consisting of valve manifold boxes (VMB), specialized piping networks, and integrated real-time chemical monitoring platforms; and advanced packaging materials and processing equipment, featuring direct liquid injection (DLI) vaporizers, glass substrate processing systems for semiconductor interposers, high-thermal-conductivity ceramic sheets, and fluoropolymer-laminated composite materials. C&G HI Tech serves tier-one integrated device manufacturers, semiconductor foundries, memory chip producers, and display panel manufacturers across South Korea, China, and international markets. In recent operational and strategic developments, C&G HI Tech has accelerated its expansion into advanced packaging technologies by developing and commercializing specialized processing equipment for next-generation glass core substrates, targeting high-density interconnect applications for artificial intelligence accelerators and high-performance computing devices. In addition, the company has expanded its portfolio of eco-friendly semiconductor equipment through enhanced closed-loop chemical reclaim and SPM recycling systems aimed at reducing fab chemical waste and lowering greenhouse gas emissions. C&G HI Tech continues to strengthen strategic technical collaborations with leading semiconductor manufacturers to support global wafer fab capacity expansions and next-generation device fabrication.