INNOX Advanced Materials Co., Ltd. manufactures and supplies advanced materials for semiconductors, flexible printed circuit boards and displays, primarily serving the IT and electronics industries; its core products include semiconductor packaging materials such as lead-on-chip tapes, lead lock tapes and adhesive solutions; flexible printed circuit board materials encompassing flexible copper clad laminates, polyimide films and coverlay films; and organic light-emitting diode materials for displays. The company operates production facilities in South Korea, with additional sites in China and Vietnam, and targets customers in smartphones, tablets, notebooks, automobiles and semiconductor sectors worldwide. Founded in 1988 and headquartered in Asan-si, South Korea, INNOX Advanced Materials maintains a full product lineup for semiconductor packaging in Korea and holds the world's largest production capacity in semiconductor packaging and FPCB materials. Recent developments include a June 2024 collaboration between its subsidiary INNOX eco-M and NEO Battery Materials to develop silicon anode products using high-purity recycled silicon powders, enhancing electrochemical performance and supply chain resilience; expansion plans for silicon-oxide powder production in Vietnam; and a completed equity buyback in late 2024 involving 452,000 shares for KRW 9.9 billion.