HB SOLUTION CO. LTD.
KKRX:2978901,442.00
KRW
+3.00
(+0.21%)
ISIN
KR7297890006
Return %
Stock
S&P 500
1Y
-46.19
14.39
3Y
-69.86
81.42
5Y
-67.50
68.62
Capital Structure
KRW
•
in mil. unless spec.Working Capital
KRW
•
in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
•
in mil. unless spec.Quarterly Earnings Per Share
KRW
•
in mil. unless spec.Quarterly Dividends Per Share
KRW
•
in mil. unless spec.Company Description
- CEO
- Jae-Won Lee
- Full Time Employees
- 238
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Asan-si South Korea
- IPO Date
- Jun 22, 2020
- Website
- hb-solution.co.kr
- Similar Companies
- Business
- HB SOLUTION CO. LTD. is a South Korea-based technology company engaged in the design, engineering, and manufacturing of advanced automated process, inspection, and measurement equipment for the display, semiconductor, and secondary battery industries. Founded in 2001 as LET Co., Ltd. and established in its current form through a July 2021 merger with optical metrology specialist K-MAC Co., Ltd., the company operates as a core equipment subsidiary of HB Technology Co., Ltd. within the HB Group. Headquartered in Sejong-si, South Korea, with manufacturing facilities in Asan-si and an R&D center in Pangyo, the company supplies specialized manufacturing systems to leading display panel makers, semiconductor fabricators, and electronic component manufacturers across South Korea, China, Vietnam, and other international markets. The company operates across four primary business segments: Display Module and Automation Equipment, Display Front-End and Optical Metrology Systems, Semiconductor Metrology Equipment, and Secondary Battery Inspection Systems. Its product and service portfolio encompasses: Display Back-End and Module Automation Systems, including proprietary Edge Light Blocking (ELB) ultra-precision resin dispensers engineered to eliminate light leakage around punch-hole cameras and curved edges in mobile and IT OLED panels, optical clear resin (OCR) and optical clear adhesive (OCA) vacuum laminators, panel bonding machines, cover window assembly modules, and automated optical inspection (AOI) sorting handlers; Display Front-End and Optical Metrology Instruments, including inline spectroscopic ellipsometers, reflectometers, thin-film thickness measurement tools, chamber visual inspection equipment, color defect analyzers, and substrate-level macro defect inspection platforms; Semiconductor Metrology and Defect Analysis Equipment, led by Nano-MEIS (Medium Energy Ion Scattering) non-destructive atomic-layer depth profiling and chemical composition metrology tools used for ultra-thin film and gate dielectric analysis in advanced wafer fabrication; Precision Inkjet Printing Solutions, comprising high-precision deposition systems for OLED thin-film encapsulation (TFE), quantum dot (QD) color conversion layering, and micro-patterning; and Secondary Battery Manufacturing Equipment, consisting of high-speed electrode sheet slitting width measurement tools and automated quality verification inspection systems. In recent developments, HB Solution has accelerated its strategic expansion across next-generation microdisplays, advanced semiconductor metrology, and high-growth OLED manufacturing supply chains. The company secured major multi-million-dollar equipment supply agreements in 2026 with Samsung Display Vietnam (SDV) for next-generation display production lines running through 2027, building on substantial international equipment delivery contracts executed with Chengdu BOE Display Technology in China. To optimize production capacity and drive research synergies across HB Group affiliates, the company has consolidated its regional manufacturing and engineering infrastructure into a unified corporate campus in Sejong-si. On the technological front, HB Solution is serving as the lead organization for a South Korean Ministry of Trade, Industry and Energy national R&D project running through 2027 focused on artificial intelligence-driven simultaneous full-sheet inspection systems for OLED-on-Silicon (OLEDoS) microdisplays utilized in Extended Reality (XR) hardware, co-registering multiple core inspection patents. Concurrently, the company continues the qualification and commercial deployment of its Nano-MEIS semiconductor metrology platforms with tier-one semiconductor integrated device manufacturers and global foundries.