1. South Korea Stocks

  2. •

    Electronic technology

  3. •

    Electronic components
Daeduck Electronics Co., Ltd.

Daeduck Electronics Co., Ltd.

124,200.00
KRW
-3,300.00
(-2.59%)
3,013.73EPS
50.97P/E
7.59TMarket Cap
Oct 30Next Earn
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
11,883.41
19,422.37
25,546.82
17,635.42
17,307.55
20,676.93
26,780.44
Basic EPS, GAAP
-170
1,223
3,570
492
461
924
3,013.73
Free Cash Flow per Basic Share
-336.68
1,394.28
1,673.79
1,154.04
689.09
85.65
1,323.63
Dividend per Share
- -
300.05
300.16
399.67
300.01
400.14
- -
Book Value per Share
12,884.92
13,777.37
17,280.34
17,550.43
17,695.68
18,136.65
19,746.32
Tangible Book Value per Share
12,596.7
13,506.58
17,036.43
17,291.4
17,474.08
17,891.3
19,519.22
Basic Weighted Avg Shares
51
52
52
52
52
52
50
Sales/Revenue/Turnover
610,920
1,000,932
1,316,163
909,651
892,136
1,065,295
1,351,350
Operating Margin (%)
1.44
7.24
17.67
2.61
1.26
4.61
12.95
Depreciation Expense
56,812
101,057
104,805
115,050
117,436
100,508
94,424
Net Income, GAAP
-8,740
63,027
183,925
25,378
23,763
47,605
152,074
Effective Tax Rate (%)
- -
15.53
24.78
10.57
21.23
10.9
22.41
Profit Margin (%)
-1.43
6.3
13.97
2.79
2.66
4.47
11.25
Working Capital
106,267
190,398
233,073
256,321
306,178
340,319
400,257
LT Debt
4,212
157
19,197
13,031
6,648
45
154
Total Equity
637,781
681,883
854,989
868,336
875,514
897,305
976,850
Return on Invested Capital (%)
- -
9.04
21.4
2.33
0.99
4.75
14.23
Return on Capital (%)
- -
9.52
23.56
2.96
2.73
5.32
16.27
Return on Common Equity (%)
- -
9.57
23.97
2.95
2.73
5.38
16.66

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
41,166
9,559
8,018
LT Borrowings
- -
- -
- -
LT Finance Leases
45
39
154
Preferred Equity and Hybrid Capital
1,048
1,048
1,048
Shares Outstanding
49
49
49
Market Capitalization
2,327,537
3,790,278
7,590,440

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
588,418
596,673
708,567
Cash, Cash Equivalents & STI
228,392
216,243
224,891
Accounts Receivable, Net
196,563
200,840
252,286
Inventories
148,608
159,404
203,316
Total Current Liabilities
248,099
246,364
308,310
Payables & Accruals
- -
- -
- -
ST Debt
41,166
9,559
8,018
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
7.44%
2.49%
Free Cash Flow
- -
-130.8%
-87.58%
Net Income, GAAP
- -
-124.31%
100.34%
Sales/Revenue/Turnover
- -
16.38%
19.41%
Total Cash Common Dividend
- -
- -
33.31%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
214,766
238,239
232,654
206,477
892,136
2025
215,376
245,858
286,173
317,888
1,065,295
2026
346,314
400,975
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
38
237
100
85.11
461
2025
-111
86
471.07
497.32
924
2026
920.79
1,120
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
300.01
2025
- -
- -
- -
- -
400.14
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Young-Hwan Shin
Full Time Employees
2,633
Sector
Electronic technology
Industry
Electronic components
Address
230 Kangchon-ro Ansan-si GY South Korea 15602
IPO Date
May 21, 2020
Website
daeduck.com
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Business
DAEDUCK ELECTRONICS Co., Ltd. manufactures and sells printed circuit boards (PCBs), including thin PCBs for semiconductor packaging such as flip chip ball grid array (FCBGA), flip chip chip scale package (FCCSP), chip scale package (CSP), system in package (SiP), antenna in package (AiP), and flip chip board on chip (FCBOC); multi-layered PCBs with 20 or more layers supporting high-speed/high-frequency applications for 5G communication; and solutions for smartphones, autonomous vehicles, data centers, servers, automotive microprocessors (MPU), high-speed communication chips, and graphics DRAM (GDDR7). The company operates primarily in South Korea with international sales, targeting semiconductor, consumer electronics, automotive, networking, and computing sectors. Founded in 1972 and headquartered in Ansan-si, Gyeonggi Province, South Korea, it maintains production facilities equipped for ultra-thin coreless substrates under 0.04mm thickness and large-area FCBGA panels exceeding 60x60mm using build-up and semi-additive process (SAP) technologies. In recent developments, DAEDUCK ELECTRONICS developed a large-body FCBGA substrate tailored for AI servers and data centers, enhancing its capabilities in high-performance computing amid growing demand. The company partnered with a global outsourced semiconductor assembly and test (OSAT) provider to enter the server FC-BGA market, positioning it for supply growth in electric vehicle (EV) recovery and non-memory chips starting in the second half of 2024. It continues to secure new customers for advanced memory substrates like GDDR7, with analysts forecasting record quarterly sales and profits in the third quarter of 2025 driven by memory, non-memory, and multi-layered PCB rebounds, alongside improved utilization from automotive autonomous driving chips and server controllers.