KOSTECSYS. CO. LTD.
KKRX:35515016,160.00
KRW
-710.00
(-4.21%)
ISIN
KR7355150004
Return %
Stock
S&P 500
1Y
16.34
13.14
3Y
70.37
80.78
5Y
52.45
67.74
Capital Structure
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KRW
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Kyu-Jin Han
- Full Time Employees
- 67
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Inchon South Korea
- IPO Date
- Sep 18, 2020
- Website
- kostec.net
- Similar Companies
- Business
- KOSTECSYS Co., Ltd. is a South Korean technology and advanced materials manufacturing company that specializes in low-thermal-expansion and high-heat-dissipation semiconductor packaging and thermal management solutions. Founded in 2001 and headquartered in Incheon, South Korea, the company develops, engineers, and manufactures specialized thermal materials and package components designed to optimize heat dissipation, prevent thermal stress, and protect high-power compound semiconductor chips, including Silicon Carbide (SiC) and Gallium Nitride (GaN) devices. The company organizes its product offerings across several core business segments, including high-heat-dissipation materials, semiconductor packaging, power electronics components, and advanced thermal cooling modules. Its proprietary product and service portfolio encompasses KCMC (Kostec Copper Molybdenum Composite) laminated metal sheets, including copper-molybdenum-copper (Cu/Mo/Cu) and customized metal matrix composites; radio frequency (RF) packages and high-frequency air-cavity ceramic and plastic packages for 5G telecommunication base stations and power transistors; thermal spacers and thermal-matched lead frames for electric vehicle (EV) inverters and power modules; photonic integrated circuit (PIC) packages, laser diode (LD) submounts, and optical communication components; pin-fin and flat-type power base plates; copper pins, pillars, and current sensor shunt resistors; liquid cold plates and precision heat sink blocks; and specialized contract manufacturing services encompassing spark plasma sintering (SPS) diffusion bonding, automated reel-to-reel and rack plating, precision brazing, and micro-machining. These products primarily serve original equipment manufacturers (OEMs), integrated device manufacturers (IDMs), and semiconductor foundries operating across wireless communications, automotive electrification, artificial intelligence (AI) data centers, aerospace and defense radar, industrial power conversion, and medical electronics sectors across Asia, North America, and Europe. In recent strategic developments, KOSTECSYS completed its public listing on the KOSDAQ market (KRX: 355150) in April 2023 through a merger with Kyobo 10th Special Purpose Acquisition Company (SPAC). Following its listing, the company has accelerated its strategic expansion beyond legacy telecommunication RF packages into high-density power semiconductor thermal components for electric vehicles and AI computing infrastructure. In recent operations, KOSTECSYS secured multi-million-dollar supply agreements and single-source vendor status with tier-one North American and global semiconductor manufacturers for proprietary thermal spacers utilized in AI data center power delivery architectures. To support this volume growth, the company expanded its manufacturing footprint and production capacity across its Incheon facilities, establishing dedicated high-volume production lines for power semiconductor spacers and next-generation composite heat spreaders, while maintaining its long-term strategic supply partnership with global automotive semiconductor leader NXP Semiconductors.