TLB Co., Ltd.
KKRX:35686036,650.00
KRW
-850.00
(-2.27%)
ISIN
KR7356860007
Return %
Stock
S&P 500
1Y
12.14
14.39
3Y
264.15
81.42
5Y
378.66
68.62
Capital Structure
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•
in mil. unless spec.Working Capital
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•
in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Seong-Hyeon Baek
- Full Time Employees
- 465
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- Ansan-si South Korea
- IPO Date
- Dec 14, 2020
- Website
- tlbpcb.com
- Similar Companies
- Business
- TLB Co., Ltd. is a South Korea-based technology company specializing in the design, engineering, and manufacture of high-performance printed circuit boards (PCBs) primarily for the global semiconductor and data storage industries. Founded in 2011 as a spin-off from Daeduck Electronics and headquartered in Ansan-si, Gyeonggi-do, South Korea, the company operates within the electronic components sector and trades on the KOSDAQ market under the ticker 356860. TLB Co., Ltd. serves tier-one integrated device manufacturers, memory producers, and computing hardware companies, including Samsung Electronics, SK Hynix, and Micron Technology, supplying specialized substrate solutions for enterprise data centers, artificial intelligence servers, and high-performance computing platforms. The company's core product portfolio encompasses a comprehensive range of multilayer, high-density interconnect printed circuit boards engineered to meet rigorous speed and thermal standards. Main product offerings include Solid-State Drive (SSD) PCBs, comprising high-density substrate boards for enterprise and client SSDs utilizing PCIe, NVMe, SAS, and SATA interfaces; Memory Module PCBs, encompassing high-speed boards for DDR4 and DDR5 Registered Dual In-line Memory Modules (R-DIMM), Load-Reduced Dual In-line Memory Modules (LR-DIMM), Unbuffered Dual In-line Memory Modules (U-DIMM), and Small Outline Dual In-line Memory Modules (SO-DIMM); Next-Generation AI and High-Bandwidth Substrates, featuring Compute Express Link (CXL) memory expander PCBs, Small Outline CXL-based Advanced Memory Module (SOCAMM and SOCAMM2) boards, and Low Power Compression Attached Memory Module (LPCAMM2) substrates; and Semiconductor Test Board PCBs, consisting of probe card boards, burn-in boards, and final test interface boards utilized for wafer and package-level semiconductor reliability testing. In addition to precision hardware fabrication, the company delivers engineering design verification, signal integrity analysis, surface-mount technology assembly support, and custom layout optimization services. TLB Co., Ltd. conducts operations across South Korea and Southeast Asia, maintaining primary production and research facilities in Ansan-si, South Korea, alongside its overseas manufacturing subsidiary, TLB VINA CO., LTD., situated in Bac Ninh Province, Vietnam. In recent operational and strategic developments, the company significantly broadened its international manufacturing capacity through the construction and expansion of a second production plant at its TLB VINA site in Vietnam to double output capacity and address escalating worldwide demand for memory module substrates. In response to rapid growth in artificial intelligence server architectures, the company has advanced development and customer qualification for next-generation LPDDR6-based SOCAMM substrates and CXL memory expansion boards. Furthermore, TLB Co., Ltd. has integrated artificial intelligence and digital twin technologies into its domestic manufacturing lines through designated smart factory initiatives, enhancing multilayer yield optimization and reinforcing its supply chain integration with global memory manufacturers.