HiDeep Inc.

HiDeep Inc.

KKRX:365590
1,406.00
KRW
-57.00
(-3.90%)
-624.58EPS
56.65BMarket Cap
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
- -
703.45
688.62
374.51
1,023.61
57.78
16.61
Basic EPS, GAAP
-34.93
-235
-265
-335
-1,640
-484
-624.58
Free Cash Flow per Basic Share
-16.24
-158.09
-146
-142.28
-1,051.64
-244.41
-358.07
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
8,790.22
8,801.85
663.04
537.14
260.64
72.3
82.01
Tangible Book Value per Share
8,790.22
5,744.45
558.71
440.66
108.02
8.06
10.37
Basic Weighted Avg Shares
1
19
26
28
6
31
27
Sales/Revenue/Turnover
- -
13,309
18,145
10,484
5,890
1,767
453
Operating Margin (%)
- -
-28.27
-12.52
-82.17
-154.85
-660.66
-2,863.36
Depreciation Expense
- -
640
629
1,223
1,406
1,705
1,519
Net Income, GAAP
-32
-4,446
-6,983
-9,377
-9,437
-14,802
-17,033
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
- -
-33.41
-38.48
-89.45
-160.22
-837.68
-3,760.73
Working Capital
9,847
3,635
25,937
8,959
376
3,851
-3,006
LT Debt
1,746
33
13,470
33
596
8,115
52
Total Equity
8,087
8,190
18,207
15,402
7,522
2,236
2,536
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
-54.94
-53.09
-55.8
-82.33
-303.4
-232.76

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
598
3,917
9,070
LT Borrowings
8,115
8,454
- -
LT Finance Leases
- -
- -
52
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
31
31
31
Market Capitalization
174,110
125,549
56,651

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
5,417
6,217
7,031
Cash, Cash Equivalents & STI
3,947
4,796
5,867
Accounts Receivable, Net
190
24
- -
Inventories
14
14
- -
Total Current Liabilities
1,566
4,818
10,037
Payables & Accruals
- -
- -
- -
ST Debt
598
3,917
9,070
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
-2.65%
-70.27%
Free Cash Flow
- -
4,006.01%
23.52%
Net Income, GAAP
- -
2,776.64%
56.85%
Sales/Revenue/Turnover
- -
- -
-70%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,056
1,566
891
1,376
5,890
2025
1,019
342
193
213
1,767
2026
22
25
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-55
-100
-100
-141.11
-1,640
2025
-375
-380
-81.21
-500.11
-484
2026
-101.37
-115
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Beom-Kyu Koh
Full Time Employees
68
Sector
Electronic technology
Industry
Semiconductors
Address
Seongnam-si South Korea
IPO Date
Dec 21, 2020
Website
hideep.com
Business
HiDeep Inc. is a South Korea-based fabless semiconductor and Human-Machine Interface (HMI) technology company that specializes in the design, development, and commercialization of advanced touch controller integrated circuits (ICs), sensor hardware, and embedded software algorithms for smart display devices. The company operates within the semiconductor and electronic components industry, offering a comprehensive product portfolio that includes touch controller ICs optimized for flexible and foldable active-matrix organic light-emitting diode (AMOLED) panels; 3D force touch sensor controllers capable of multi-level Z-axis pressure detection; active stylus controller ICs supporting universal protocols such as Microsoft Pen Protocol (MPP) 2.0 and Universal Stylus Initiative (USI) 1.0; passive stylus solutions with advanced palm-rejection capabilities; on-cell touch sensor architectures engineered to suppress high display noise in thin panel structures; and proprietary touch signal processing firmware and interface software. HiDeep Inc. targets original equipment manufacturers (OEMs), original design manufacturers (ODMs), and display panel makers across the smartphone, tablet, laptop, wearable, and automotive electronics markets, serving clients across South Korea, Greater China, North America, and other global regions. In recent operational developments, the company has actively expanded strategic engineering collaborations with major display panel manufacturers to develop next-generation digitizer-less and battery-free stylus technologies for ultra-thin foldable screens. HiDeep Inc. has also continued expanding its global intellectual property portfolio in low-noise OLED touch sensing architectures, completed a 1-for-2 stock split, and executed a 6.5 billion won paid-in capital increase to support ongoing research and development in next-generation HMI semiconductors. Founded in 2010, HiDeep Inc. is headquartered in Seongnam-si, Gyeonggi-do, South Korea, and is publicly listed on the KOSDAQ market of the Korea Exchange under the ticker 365590.