Zaram Technology, Inc.

Zaram Technology, Inc.

KKRX:389020
11,280.00
KRW
+100.00
(+0.89%)
-640.84EPS
158.29BMarket Cap
Nov 12Next Earn
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
8,097.16
2,888.27
3,080.82
1,932.88
3,610.31
1,716.79
2,528.33
Basic EPS, GAAP
226
236
118
-211
323
-1,104
-640.84
Free Cash Flow per Basic Share
-404.62
-544.96
217.69
-1,231.41
589.63
0.06
320.89
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
1,789.83
2,933.86
3,570.46
5,765.3
6,841.9
5,737.56
9,315.55
Tangible Book Value per Share
1,659.76
2,808.63
3,243.39
5,548.23
6,526.08
5,568.81
9,051.79
Basic Weighted Avg Shares
1
5
5
6
6
6
6
Sales/Revenue/Turnover
11,527
14,324
16,118
11,623
22,170
10,644
16,126
Operating Margin (%)
0.72
2.04
1.26
-18.42
1.65
-66.37
-37.12
Depreciation Expense
371
447
482
589
972
992
1,191
Net Income, GAAP
322
1,170
617
-1,269
1,983
-6,844
-4,087
Effective Tax Rate (%)
- -
- -
- -
- -
14.16
- -
- -
Profit Margin (%)
2.79
8.17
3.83
-10.92
8.95
-64.31
-25.35
Working Capital
6,909
13,418
14,549
28,181
14,788
1,708
25,010
LT Debt
- -
181
32
254
214
659
352
Total Equity
11,157
18,215
18,823
35,471
42,518
35,674
60,670
Return on Invested Capital (%)
- -
- -
- -
- -
0.58
- -
- -
Return on Capital (%)
- -
- -
- -
- -
5.17
- -
- -
Return on Common Equity (%)
- -
8.03
3.35
-4.69
5.1
-17.56
-8.2

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
32,657
22,088
7,266
LT Borrowings
- -
- -
- -
LT Finance Leases
659
507
352
Preferred Equity and Hybrid Capital
114
- -
114
Shares Outstanding
6
7
7
Market Capitalization
232,415
314,949
158,287

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
42,318
47,882
38,162
Cash, Cash Equivalents & STI
25,097
21,157
25,164
Accounts Receivable, Net
6,164
9,485
1,587
Inventories
5,557
5,698
5,298
Total Current Liabilities
40,610
36,488
13,152
Payables & Accruals
- -
- -
- -
ST Debt
32,657
22,088
7,266
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
31.76%
-16.1%
Free Cash Flow
- -
-154.4%
-99.99%
Net Income, GAAP
- -
-158.08%
-445.07%
Sales/Revenue/Turnover
- -
9.53%
-51.99%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
5,958
5,311
5,629
5,272
22,170
2025
3,098
2,700
2,095
2,751
10,644
2026
5,185
6,095
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
207
64
5
47.5
323
2025
-265
-259
-275.03
-305.91
-1,104
2026
-39.28
-35.13
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Joon-Hyun Baek
Full Time Employees
70
Sector
Electronic technology
Industry
Semiconductors
Address
Seongnam-si South Korea
IPO Date
Mar 7, 2023
Website
zaram.com
Business
Zaram Technology, Inc. (KRX: 389020) is a South Korea-based fabless semiconductor design and telecommunications equipment company specializing in low-power communication systems-on-chip (SoCs), optical transceivers, and broadband network connectivity solutions. Founded in 2000 and headquartered in Seongnam-si, Gyeonggi-do, South Korea, the company develops, manufactures, and commercializes high-speed telecommunications hardware and custom integrated circuits for telecommunications service providers, network equipment original equipment manufacturers (OEMs), enterprise data centers, and industrial automation clients across domestic and international markets, including the Americas, Europe, and the Asia-Pacific region. The company operates through core business segments encompassing optical communications, broadband access semiconductors, custom ASIC development, automotive networking, and next-generation artificial intelligence (AI) processing. Zaram Technology offers a systematic portfolio of products and services that includes: proprietary 10-Gigabit Symmetrical Passive Optical Network (XGS-PON) System-on-Chip (SoC) semiconductors such as the ZX300 processor series; pluggable optical network unit (ONU) devices, featuring integrated XGS-PON SFP+ stick modules designed for Fiber-to-the-Home (FTTH) and 5G/6G wireless fronthaul and backhaul deployments; advanced next-generation optical access intellectual property (IP), including 25GS-PON and 50G-PON architectures; optical transceivers spanning 1 Gbps to 100 Gbps form factors for optical-to-electrical signal conversion in mobile base stations, metro networks, and data center infrastructures; G.hn-standard GiGaWire solutions engineered to deliver gigabit broadband speeds across legacy copper telephone lines and coaxial wiring; full-custom Application-Specific Integrated Circuit (ASIC) and System-on-Chip design, verification, and turnkey manufacturing services; mobility-grade high-speed Ethernet switch SoCs and in-vehicle networking processors for Software-Defined Vehicles (SDVs); and ultra-low-power edge computing processors utilizing open-source RISC-V architectures and neuromorphic processing engines for on-device AI applications. In recent developments, Zaram Technology has transitioned its proprietary XGS-PON stick ONU product lines into commercial mass production, securing recurring volume production orders from global telecommunications equipment providers. The company has expanded its strategic footprint in the mobility and artificial intelligence semiconductor sectors, serving as the lead organization on South Korean government-backed research and development consortiums to develop automotive Ethernet switch SoCs and in-vehicle communication semiconductors through 2026 and 2028. Additionally, Zaram Technology has advanced strategic research collaborations with global AI technology partners, such as Numenta, to develop RISC-V-based neuromorphic AI coprocessors, while strategically reallocating specialized engineering and development resources to accelerate the commercialization of its on-device AI and automotive semiconductor divisions following the contractual realignment of secondary legacy custom chip design programs.