1. South Korea Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
GAONCHIPS Co., Ltd.

GAONCHIPS Co., Ltd.

KKRX:399720
34,850.00
KRW
-2,450.00
(-6.57%)
-469.27EPS
463.44BMarket Cap
Nov 18Next Earn
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
648,443.67
2,954.76
3,529.73
4,048.94
5,533.3
8,392.78
5,907.39
7,386.54
Basic EPS, GAAP
81,584.38
320
677
413
552
655
-1,239
-469.27
Free Cash Flow per Basic Share
-82,503.78
-118.03
64.09
-542.05
-453.96
0.44
-791.47
1,739.49
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
773.07
951.55
1,912.97
4,734.32
5,398.49
5,980.26
4,714.33
6,188.93
Tangible Book Value per Share
754.8
843.28
1,823.52
4,252.18
4,856.34
5,533.53
4,154.82
5,276.82
Basic Weighted Avg Shares
- -
6
9
11
11
11
12
12
Sales/Revenue/Turnover
25,938
17,098
32,236
43,321
63,597
96,492
68,510
86,050
Operating Margin (%)
11.08
11.54
19.24
9
6.93
3.65
-24.41
-10.63
Depreciation Expense
316
849
1,230
2,231
4,250
5,915
7,477
8,010
Net Income, GAAP
3,263
1,852
6,183
4,419
6,344
7,531
-14,369
-5,467
Effective Tax Rate (%)
5.17
1.35
6.19
- -
- -
- -
- -
- -
Profit Margin (%)
12.58
10.83
19.18
10.2
9.98
7.8
-20.97
-6.35
Working Capital
6,373
10,822
16,108
40,613
39,537
38,492
15,767
31,956
LT Debt
- -
244
1,073
3,557
6,363
6,223
6,230
5,926
Total Equity
8,835
10,875
21,862
54,389
62,020
69,355
54,688
71,794
Return on Invested Capital (%)
- -
18.18
32.29
- -
- -
- -
- -
- -
Return on Capital (%)
- -
18.49
36.22
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
18.79
37.77
11.59
10.9
11.46
-23.17
-8.3

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
20,648
21,312
15,622
LT Borrowings
4,825
4,825
4,825
LT Finance Leases
1,405
1,296
1,101
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
12
12
12
Market Capitalization
599,742
657,744
463,437

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
111,617
113,893
117,685
Cash, Cash Equivalents & STI
57,726
58,534
59,162
Accounts Receivable, Net
4,528
3,927
13,143
Inventories
1,061
1,061
1,061
Total Current Liabilities
95,850
99,267
85,730
Payables & Accruals
- -
- -
- -
ST Debt
20,648
21,312
15,622
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
50.91%
-21.15%
Free Cash Flow
- -
-36,659.05%
-181,908.58%
Net Income, GAAP
- -
-4.63%
-290.81%
Sales/Revenue/Turnover
- -
38.49%
-29%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
17,935
23,270
28,908
26,379
96,492
2025
15,201
9,139
11,063
33,107
68,510
2026
20,570
21,310
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-35
131
144
415
655
2025
-485
-352
-515.99
114.58
-1,239
2026
-132.72
61.82
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Kyu-Dong Jung
Full Time Employees
261
Sector
Electronic technology
Industry
Semiconductors
Address
Seongnam-si South Korea
IPO Date
May 20, 2022
Website
gaonchips.com
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Business
GAONCHIPS Co., Ltd. is a South Korea-based semiconductor design solution provider that specializes in full-turnkey application-specific integrated circuit (ASIC) and system-on-chip (SoC) design services. Founded in 2012 and headquartered in Seongnam-si, South Korea, the company operates as a premier Design Solution Partner (DSP) for Samsung Electronics Foundry and an approved design partner for Arm Holdings. GAONCHIPS provides end-to-end semiconductor design, implementation, and manufacturing support services, including system architecture specification and register-transfer level (RTL) design support; logic synthesis, floorplanning, and place-and-route (P&R) physical layout design; design for testability (DFT) and static timing analysis (STA); power, performance, and area (PPA) optimization; intellectual property (IP) qualification, customization, and hardening; advanced multi-die chiplet and 2.5D/3D packaging design; wafer foundry fabrication coordination; and post-silicon validation, packaging, testing, and mass-production supply chain management. The company caters to global fabless semiconductor developers across artificial intelligence (AI), high-performance computing (HPC), automotive systems, consumer electronics, and internet of things (IoT) markets. In recent developments, GAONCHIPS has expanded its international footprint by establishing and scaling operational subsidiaries in Japan and the United States to secure overseas automotive and AI accelerator design contracts. Furthermore, the company has broadened its technical engagement with Samsung Foundry and Arm to execute advanced sub-5-nanometer (nm), 4nm, 3nm Gate-All-Around (GAA), and 2nm next-generation turnkey design projects, while integrating high-bandwidth memory (HBM) architectures and expanding ISO 26262-compliant functional safety design solutions for autonomous driving platforms.