Laserssel Co., Ltd.
KKRX:4123505,340.00
KRW
+190.00
(+3.69%)
ISIN
KR7412350001
Return %
Stock
S&P 500
1Y
151.08
13.14
3Y
-42.15
80.78
5Y
- -
67.74
Capital Structure
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•
in mil. unless spec.Working Capital
KRW
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in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Geon-Jun Ahn
- Full Time Employees
- 39
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Hwaseong-si South Korea
- IPO Date
- Jun 24, 2022
- Website
- laserssel.com
- Similar Companies
- Business
- Laserssel Co., Ltd. is a South Korea-based precision equipment manufacturer specializing in the development, production, and commercialization of advanced area laser processing systems and optical modules for semiconductor packaging, flat-panel displays, and secondary battery manufacturing. Founded in 2015 and headquartered in Cheonan, South Korea, the company operates across global technology supply chains, delivering equipment and technical services to integrated device manufacturers, outsourced semiconductor assembly and test (OSAT) providers, display panel makers, and automotive component suppliers throughout South Korea, Greater China, North America, Southeast Asia, and Europe. Laserssel’s product and service portfolio centers on its proprietary Beam Sharpening Optical Module (BSOM) technology, which generates uniform, customizable rectangular area laser beams to enable rapid and selective thermal processing without thermal damage to adjacent components. The company's core commercial offerings include advanced semiconductor packaging systems, featuring Area Laser Reflow (ALR) systems for surface mount technology and flip-chip ball grid arrays; Laser Compression Bonding (LCB) equipment for 2.5D/3D packaging, chiplets, and high-bandwidth memory (HBM) stacking; and Laser Assisted Bonding (LAB) platforms designed to eliminate substrate warpage in ultra-thin microelectronics; display and micro-LED processing equipment, encompassing high-speed micro-LED and mini-LED mass transfer, bonding, and repair machines; Laser De-Bonding (LDB) systems for flexible and curved display panels; and high-precision laser soldering units for camera modules, optical transceivers, and wearable sensors; secondary battery and electric vehicle equipment, comprising automated laser tab-to-busbar welding systems, battery cell interconnect machines, and structural module welding apparatus; and specialized optical hardware and software, including customized BSOM optical heads, high-power diode laser engines, real-time pyrometric thermal monitoring units, and proprietary closed-loop process control software. In recent operational and strategic developments, Laserssel has accelerated its expansion into artificial intelligence (AI) semiconductor packaging through strategic collaborations and qualification trials with tier-one global semiconductor foundries and OSAT leaders for its next-generation ultra-large area laser compression bonders. The company has also broadened its commercial footprint by launching automated high-throughput laser welding solutions for electric vehicle battery pack assembly lines, establishing localized technical support infrastructure across North American and East Asian manufacturing centers, and securing international patents covering beam-shaping optical architectures and high-density heterogeneous integration processes.