Enjet Co., Ltd.

Enjet Co., Ltd.

KKRX:419080
4,395.00
KRW
-115.00
(-2.55%)
-600.51EPS
35.80BMarket Cap
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
830.61
2,405.74
2,507.18
1,153.37
606.42
539.77
985.95
Basic EPS, GAAP
102
-7,146
476
30
-337
-720
-600.51
Free Cash Flow per Basic Share
-214.97
337.09
282.28
128.03
-294.18
-1,056.12
-1,061.19
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
-1,113.08
2,007.9
4,503.53
4,587.84
4,015.99
3,455.04
3,502.62
Tangible Book Value per Share
-1,121.15
1,997.09
4,494.14
4,570.95
3,936.98
3,365.36
2,714.65
Basic Weighted Avg Shares
4
4
9
10
10
10
10
Sales/Revenue/Turnover
3,329
10,055
21,666
12,073
6,260
5,415
9,852
Operating Margin (%)
-43.31
17.57
23.98
-17.55
-104.38
-115.99
-50.26
Depreciation Expense
484
552
707
678
748
813
805
Net Income, GAAP
409
-29,867
4,113
314
-3,479
-7,223
-6,001
Effective Tax Rate (%)
- -
- -
26.27
- -
- -
- -
- -
Profit Margin (%)
12.28
-297.04
18.99
2.6
-55.57
-133.39
-60.91
Working Capital
696
14,328
40,384
39,575
31,701
27,855
22,358
LT Debt
95
100
177
268
160
4,498
13,118
Total Equity
-11,707
21,119
47,367
48,254
40,684
34,408
34,882
Return on Invested Capital (%)
- -
- -
10.46
- -
- -
- -
- -
Return on Capital (%)
- -
- -
11.37
- -
- -
- -
- -
Return on Common Equity (%)
- -
- -
12.01
0.66
-7.82
-19.24
-16.85

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
102
93
58
LT Borrowings
4,450
9,619
13,094
LT Finance Leases
47
25
24
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
10
10
10
Market Capitalization
81,263
47,204
35,802

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
29,339
19,034
24,613
Cash, Cash Equivalents & STI
23,551
13,415
17,620
Accounts Receivable, Net
392
1,273
344
Inventories
1,714
3,097
5,623
Total Current Liabilities
1,483
2,749
2,255
Payables & Accruals
- -
- -
- -
ST Debt
102
93
58
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
-37.07%
-15.43%
Free Cash Flow
- -
-62.64%
248.86%
Net Income, GAAP
- -
-1,742.39%
107.62%
Sales/Revenue/Turnover
- -
42.31%
-13.5%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,004
1,834
1,988
434
6,260
2025
2,069
1,932
882
531
5,415
2026
4,365
4,074
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
47
-103
-122
-163.14
-337
2025
-102
-250
-163.2
-205.3
-720
2026
-112.11
-120
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Do-Young Byun
Full Time Employees
53
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Suwon-si South Korea
IPO Date
Nov 18, 2022
Business
Enjet Co., Ltd. is a South Korea-based technology company that specializes in the design, development, and manufacture of advanced ultra-fine precision dispensing and printing equipment utilizing proprietary electrohydrodynamic (EHD) inkjet technology. Founded in 2009 and headquartered in Suwon, South Korea, the company primarily serves the semiconductor packaging, flat-panel and flexible display, micro-LED, electronic component, and secondary battery industries across South Korea, China, Taiwan, the United States, and other international markets. Enjet operates through dedicated business segments focusing on precision printing machinery, component modules, functional process materials, and specialized engineering solutions. The company's core product portfolio encompasses a comprehensive range of EHD-based dispensing and coating systems, including ultra-precision EHD inkjet printing systems for sub-micron to micrometer pattern formation; multi-nozzle industrial coating and jetting equipment; automated micro-LED and mini-LED repair and side-wiring systems; display edge light-blocking printing systems; functional layer deposition equipment for organic light-emitting diode (OLED) panels; electromagnetic interference (EMI) shielding spray coating equipment for semiconductor packaging; underfill micro-dispensing solutions; high-voltage drop-on-demand (DoD) pulse jetting controllers and printhead modules; proprietary functional inks and conductive materials tailored for electrohydrodynamic deposition; and custom process engineering, calibration, and maintenance services for high-volume automated manufacturing lines. In recent developments, Enjet Co., Ltd. has expanded its technological footprint and commercial operations to address surging demand in advanced semiconductor packaging and next-generation display manufacturing. The company has developed and commercialized multi-nozzle EHD printing platforms capable of high-throughput mass production, transitioning from single-nozzle pilot-scale systems to fully integrated manufacturing lines. Enjet has established strategic collaborative partnerships and supply relationships with leading global display manufacturers and semiconductor packaging providers for the deployment of specialized micro-LED repair equipment and thin-film EMI shielding coating tools used in high-bandwidth memory (HBM) and advanced microelectronic packaging. Furthermore, the company has broadened its research and development initiatives into secondary battery functional coatings and biomedical sensor manufacturing, while expanding its sales and technical support infrastructure across key Asian electronics manufacturing hubs.