MICRO2NANO INC.
KKRX:4249809,570.00
KRW
-380.00
(-3.82%)
ISIN
KR7424980001
Return %
Stock
S&P 500
1Y
2.24
14.20
3Y
-24.05
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
KRW
•
in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
•
in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Gyu-Ho Hwang
- Full Time Employees
- 134
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Yongin-si South Korea
- IPO Date
- Apr 26, 2023
- Website
- micro2nano.com
- Similar Companies
- Business
- MICRO2NANO INC. is a South Korea-based semiconductor test component manufacturer specializing in micro-electro-mechanical systems (MEMS) technology for wafer-level integrated circuit testing. Founded in 2000 and headquartered in Yongin-si, Gyeonggi-do, South Korea, the company designs, develops, and manufactures high-precision test interface solutions and micro-fabricated components for the global semiconductor industry. The company operates through a specialized product and service portfolio comprising MEMS probe cards for NAND flash memory wafer testing; fine-pitch vertical MEMS probe cards for dynamic random-access memory (DRAM) and high-bandwidth memory (HBM) architectures; CMOS image sensor (CIS) probe cards; logic and system-on-chip (SoC) semiconductor test interfaces; MEMS foundry and custom micro-fabrication services; specialized MEMS sensors for automotive, healthcare, and industrial applications; and probe card refurbishment, needle replacement, and diagnostic maintenance services. The company primarily serves semiconductor integrated device manufacturers (IDMs), wafer foundries, and outsourced semiconductor assembly and test (OSAT) providers, maintaining longstanding supply relationships with major domestic and international memory manufacturers, including SK Hynix and Samsung Electronics. MICRO2NANO INC. leverages proprietary MEMS micro-machining, electroforming, thin-film deposition, and cantilever tip fabrication processes to deliver ultra-fine pitch, high-pin-count testing solutions capable of supporting high-frequency signal transmission and multi-die parallel wafer testing. In addition to its primary manufacturing, design, and research and development operations in South Korea, the company engages with global technology partners and distributors across the Asia-Pacific region, North America, and other major semiconductor markets. In recent corporate developments, MICRO2NANO INC. completed its public listing on the KOSDAQ exchange under the ticker 424980 to fund advanced research and development and scale manufacturing automation. The company has executed a major strategic expansion to diversify beyond its historical focus on NAND flash testing by accelerating the commercialization of high-value DRAM and high-bandwidth memory (HBM) probe cards engineered for artificial intelligence accelerators and high-performance computing memory modules. To support these technological advancements, MICRO2NANO INC. expanded its cleanroom and fabrication facilities in Gyeonggi Province, enhancing capacity for next-generation multi-layer ceramic substrate bonding and ultra-fine pitch micro-cantilever production. The company has also deepened joint technological evaluations and qualification partnerships with tier-one memory chipmakers to integrate its proprietary MEMS probe architectures into next-generation memory and non-memory wafer fabrication testing lines.