TFE Co., Ltd.
KKRX:42542065,000.00
KRW
+5,000.00
(+8.33%)
ISIN
KR7425420007
Return %
Stock
S&P 500
1Y
68.61
14.39
3Y
107.01
81.42
5Y
- -
68.62
Capital Structure
KRW
•
in mil. unless spec.Working Capital
KRW
•
in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
•
in mil. unless spec.Quarterly Earnings Per Share
KRW
•
in mil. unless spec.Quarterly Dividends Per Share
KRW
•
in mil. unless spec.Company Description
- CEO
- Seong-Ju Mun
- Full Time Employees
- 274
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Hwaseong-si South Korea
- IPO Date
- Nov 17, 2022
- Website
- tfe.co.kr
- Similar Companies
- Business
- TFE Co., Ltd. is a South Korea-based technology company specializing in the design, engineering, and manufacture of comprehensive semiconductor testing solutions, components, and equipment. Founded in 2003 and headquartered in Hwaseong-si, South Korea, the company delivers integrated test interfacing hardware utilized across wafer-level, package-level, and final backend testing processes for memory and system integrated circuits. The company operates through three principal product divisions: Test Sockets, Test Boards, and Change Over Kits (COK). Its core offerings include silicone rubber test sockets, fine-pitch pogo pin sockets, high-speed logic and system-on-chip (SoC) test sockets, and burn-in sockets; high-layer semiconductor test load boards, interface boards, burn-in boards, and probe station boards; mechanical Change Over Kits comprising automated test handler conversion kits, match plates, socket blocks, and thermal test chamber components; high-frequency test interface modules tailored for advanced artificial intelligence (AI) architectures, High Bandwidth Memory (HBM), Compute Express Link (CXL), LPCAMM2 and SOCAMM2 memory modules, Co-Packaged Optics (CPO), and multi-die chiplet packaging; and customized semiconductor test design, signal integrity simulation, and maintenance engineering services. TFE serves leading global integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) providers, and fabless design houses across South Korea, the United States, Taiwan, Japan, and Southeast Asia. The company operates overseas branches and sales networks in Taiwan, Singapore, and the United States, and manages its Japanese subsidiary, JMT INC., which specializes in conductive silicone rubber socket development and manufacturing. In recent developments, TFE secured its first commercial mass-production purchase orders for its turnkey SOCAMM2 total test solutions from major global memory semiconductor manufacturers, expanding its footprint in next-generation high-bandwidth mobile and AI memory module testing. The company also completed the operational scale-up of its 14.3 billion KRW advanced manufacturing facility in Hwaseong, effectively doubling its monthly test socket production capacity to meet growing demand. In addition, TFE continues to accelerate strategic investments in high-frequency, large-area rubber contactor technologies and optical interface solutions to expand its customer engagements among tier-one international AI chipmakers and OSAT facilities.