ASICLAND Co., Ltd.
KKRX:44509018,150.00
KRW
-590.00
(-3.15%)
ISIN
KR7445090004
Return %
Stock
S&P 500
1Y
-41.17
14.39
3Y
- -
81.42
5Y
- -
68.62
Capital Structure
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in mil. unless spec.Working Capital
KRW
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in mil. unless spec.Growth Rates
KRW
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Jong-Min Lee
- Full Time Employees
- 264
- Sector
- Technology services
- Industry
- Packaged software
- Address
- Suwon-si South Korea
- IPO Date
- Nov 13, 2023
- Website
- asicland.com
- Similar Companies
- Business
- ASICLAND Co., Ltd. is a South Korea-based semiconductor design service provider specializing in custom Application-Specific Integrated Circuit (ASIC) and System-on-Chip (SoC) turnkey engineering solutions. Founded in 2016 and headquartered in Suwon-si, Gyeonggi-do, South Korea, the company operates as a design house bridging fabless semiconductor developers and foundries, functioning as South Korea's sole official Value Chain Alliance (VCA) partner of Taiwan Semiconductor Manufacturing Company (TSMC) and an Arm Approved Design Partner (ADP). ASICLAND Co., Ltd. delivers end-to-end semiconductor development and manufacturing facilitation services, comprising: full-flow SoC and ASIC turnkey development solutions from architectural specification and system definition to mass production; front-end register-transfer level (RTL) logic design, intellectual property (IP) integration, and verification; back-end physical design, including floorplanning, place-and-route (P&R), design-for-test (DFT), static timing analysis, and physical verification; implementation of proprietary automated SoC design platforms, such as the A World Magic (AWM) design automation environment and the AxHub artificial intelligence I/O interface architecture; TSMC multi-project wafer (MPW) shuttle coordination and production tape-out management across legacy nodes and advanced 3nm-class FinFET and nanosheet manufacturing processes; advanced packaging design and implementation, including 2.5D and 3D heterogeneous integration, System-in-Package (SiP), and TSMC Chip-on-Wafer-on-Substrate (CoWoS) packaging technologies; and post-silicon validation, wafer testing, packaging assembly logistics, quality assurance, and high-volume supply chain management. The company caters to semiconductor and technology enterprises across application segments such as artificial intelligence (AI), high-performance computing (HPC), enterprise solid-state drive (eSSD) controllers, Compute Express Link (CXL) memory architectures, automotive electronic control units, autonomous mobility systems, robotics, and Internet of Things (IoT) networking. ASICLAND Co., Ltd. conducts international operations with research and engineering facilities in Hsinchu, Taiwan, and corporate representation in San Jose, California, United States. In recent developments, ASICLAND Co., Ltd. secured a multi-year design contract valued at approximately KRW 31.9 billion with SK hynix to develop next-generation enterprise SSD controllers; formed a strategic partnership with Egis Technology to co-develop high-performance AI server chiplet architectures utilizing TSMC 7nm technology and CoWoS advanced packaging; entered into an ASIC design and manufacturing collaboration with neuromorphic AI processor firm BrainChip; expanded its CXL memory controller development engagement with Primemas; and commercially introduced its AxHub platform to facilitate high-speed data transfer in artificial intelligence acceleration hardware.