Iron Device Corporation

Iron Device Corporation

KKRX:464500
1,825.00
KRW
-24.00
(-1.30%)
-265.51EPS
27.08BMarket Cap
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1,263.88
1,241.55
725.95
724.99
1,328.39
Basic EPS, GAAP
-759
-782
-366
-325
-265.51
Free Cash Flow per Basic Share
-952.37
-302.94
-247.54
-810.86
-729.52
Dividend per Share
- -
- -
- -
- -
- -
Book Value per Share
-185.48
1,059.03
2,231.97
1,908.22
1,795.52
Tangible Book Value per Share
-189.74
1,011.88
2,186.44
1,873.87
1,767.69
Basic Weighted Avg Shares
4
5
12
14
14
Sales/Revenue/Turnover
5,437
6,232
8,372
10,127
18,557
Operating Margin (%)
-27.68
-56.41
-58.24
-55.24
-28.43
Depreciation Expense
91
351
493
611
773
Net Income, GAAP
-3,265
-3,925
-4,221
-4,540
-3,709
Effective Tax Rate (%)
- -
- -
- -
- -
- -
Profit Margin (%)
-60.05
-62.99
-50.42
-44.83
-19.99
Working Capital
-2,239
13,528
29,431
22,537
17,190
LT Debt
339
319
1,798
1,587
12,177
Total Equity
-2,516
14,364
31,166
26,645
25,125
Return on Invested Capital (%)
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
- -
-18.54
-15.71
-13.78

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,083
2,635
2,650
LT Borrowings
1,027
1,002
11,677
LT Finance Leases
560
512
500
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
14
14
14
Market Capitalization
45,520
44,639
27,077

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
27,434
26,236
23,131
Cash, Cash Equivalents & STI
17,677
17,359
14,157
Accounts Receivable, Net
1,849
2,149
2,097
Inventories
5,556
4,982
5,092
Total Current Liabilities
4,897
4,038
5,942
Payables & Accruals
- -
- -
- -
ST Debt
1,083
2,635
2,650
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
-14.51%
Free Cash Flow
- -
- -
296.78%
Net Income, GAAP
- -
- -
7.56%
Sales/Revenue/Turnover
- -
- -
20.97%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,471
2,033
2,361
1,507
8,372
2025
1,063
890
3,113
5,062
10,127
2026
4,702
5,680
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-58.79
-57
-116
-109.11
-366
2025
-67.41
-113
-68.04
-76.97
-325
2026
-43.51
-77
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Ki-Tae Park
Full Time Employees
46
Sector
Electronic technology
Industry
Semiconductors
Address
Seoul South Korea
IPO Date
Sep 23, 2024
Business
Iron Device Corporation is a South Korea-based fabless semiconductor company specializing in the design and development of mixed-signal System-on-Chip (SoC) solutions that integrate analog, digital, and high-voltage power processing capabilities. Founded in 2008 and headquartered in Seoul, South Korea, the company develops semiconductor solutions primarily for mobile devices, consumer electronics, automotive systems, smart home appliances, and industrial robotics. The company designs and supplies a systematic portfolio of mixed-signal and power integrated circuits, which includes smart power amplifier SoCs, such as the proprietary SMA series, featuring integrated voltage boost converters and speaker protection algorithms for mobile devices and tablets; display sound amplifier ICs designed for sound-emitting flat panels; audio-haptic driver ICs that deliver synchronized acoustic output and tactile vibration feedback; high-fidelity headphone and speaker power amplifiers for artificial intelligence speakers and smart home systems; microphone interface and codec ICs; and compound power semiconductor integrated circuits, including gallium nitride (GaN) and silicon carbide (SiC) gate driver ICs designed for high-efficiency power conversion and motor actuator control. Iron Device Corporation serves global original equipment manufacturers and consumer electronics brands, supporting customers across international markets including South Korea, China (with a regional support presence in Shenzhen), Taiwan, Vietnam, India, and Brazil. In recent corporate developments, Iron Device Corporation completed its initial public offering and listed its common shares on the KOSDAQ market under the ticker symbol 464500 in September 2024. The company has diversified its business operations into the robotics and advanced power sectors by participating in the South Korean national K-Humanoid alliance to develop dedicated actuator driver semiconductors for humanoid robots. Additionally, the company has entered into strategic technical collaborations with wide-bandgap power semiconductor leaders, including Efficient Power Conversion (EPC), to advance high-voltage GaN power IC solutions, while acquiring dedicated research and development facility assets in Pangyo Techno Valley to expand its semiconductor engineering infrastructure.