- CEO
- Manu Kalevi Skyttä
- Full Time Employees
- 170
- Sector
- Electronic technology
- Industry
- Electronic components
- Address
- Keilaranta 1 Espoo UU Finland 02150
- IPO Date
- Oct 1, 1999
- Business
- Aspocomp Group Oyj develops and supplies advanced printed circuit boards across Finland, Europe, and globally. The company offers a diverse range of PCB technologies, including high-speed digital, sophisticated high-density interconnect (HDI), intricate multilayer, and high-frequency solutions, alongside specialized boards featuring integrated cooling. These critical components are integral to a wide array of demanding applications within sectors such as automotive electronics, semiconductor testing, telecommunication infrastructure, industrial electronics, and the security, defense, and aerospace industries. Beyond manufacturing, Aspocomp provides comprehensive services like design for manufacturing support, global logistics, volume supply management, and efficient PCB trading. Established in 1999 and headquartered in Espoo, Finland, with a primary manufacturing facility in Oulu, the company leverages its own production capabilities alongside an extensive international partner network in Europe and China to ensure adaptable, cost-effective, and reliable deliveries, focusing particularly on high-tech and quick-turnaround requirements. Recent activities include a directed share issue in November 2025 to support its strategic growth, aiming for over EUR 100 million in net sales by 2030.