GlobalWafers Co., Ltd.

GlobalWafers Co., Ltd.

25.40
USD
-1.80
(-6.62%)
0.63EPS
50.24P/E
15.08BMarket Cap
Nov 10Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
47.72
50.24
43.55
50
111.34
135.35
133.73
127.43
140.72
161.8
162.58
134.2
126.98
125.07
Basic EPS, GAAP
5.97
6.61
5.81
2.55
12.71
31.24
31.41
30.16
27.32
35.37
45.5
21.1
15.32
20.03
Free Cash Flow per Basic Share
5.51
7.85
3.5
3.26
32.11
67.56
22.53
14.72
54.57
58.01
-41.88
-71.31
-43.5
-15.81
Dividend per Share
2.72
5.51
5.66
5.01
2.63
10.02
25.05
25.05
18.03
16.03
16.02
18.75
11.02
2
Book Value per Share
40.25
40.46
45.38
42.8
78.01
99.3
103.74
101.64
105.04
125.05
139.24
190.75
195.51
202.68
Tangible Book Value per Share
38.3
38.38
43.48
30.77
68.98
90.9
96.31
95.2
99.59
119.59
134.33
185.62
190.65
197.83
Basic Weighted Avg Shares
326
317
352
369
415
436
434
434
434
434
435
467
477
477
Sales/Revenue/Turnover
15,570
15,922
15,310
18,427
46,213
59,064
58,094
55,359
61,131
70,287
70,652
62,626
60,598
59,709
Operating Margin (%)
14.09
14.67
17.54
7.48
16.04
29.76
30.82
27.6
28.94
35.56
28.41
22.55
14.25
12.9
Depreciation Expense
1,824
1,406
1,254
1,594
5,040
4,815
4,745
5,522
5,897
6,081
6,734
8,069
8,949
8,948
Net Income, GAAP
1,948
2,095
2,044
939
5,275
13,631
13,644
13,104
11,870
15,367
19,772
9,846
7,312
9,561
Effective Tax Rate (%)
11.6
21.79
27.19
30.14
23.22
25.31
26.51
21.13
27.82
23.57
25.39
20.84
23.17
21.16
Profit Margin (%)
12.51
13.16
13.35
5.1
11.41
23.08
23.49
23.67
19.42
21.86
27.99
15.72
12.07
16.01
Working Capital
3,616
4,298
7,121
-2,679
12,860
28,778
24,582
20,255
57,606
73,804
15,827
15,427
32,521
18,094
LT Debt
- -
- -
- -
14,367
3,663
430
628
- -
45,125
42,780
14,542
37,678
43,244
33,188
Total Equity
13,135
13,201
16,725
15,819
34,054
43,156
45,073
44,155
45,632
54,324
66,454
91,028
93,295
96,720
Return on Invested Capital (%)
13.01
12.3
11.96
3.18
12.3
26.21
24.13
21.09
16.46
18.39
12.82
7.85
4.03
3.74
Return on Capital (%)
13.29
14.26
12.56
3.33
12.17
28.24
26.3
24.01
16.01
15.68
18.04
7.57
5.02
6.82
Return on Common Equity (%)
14.95
15.91
13.66
5.78
21.17
35.32
30.94
29.37
26.44
30.75
32.74
12.5
7.93
10.15

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
31,010
37,445
26,988
LT Borrowings
43,244
29,221
33,188
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
477
477
477
Market Capitalization
194,377
199,655
480,162

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
86,629
76,922
82,387
Cash, Cash Equivalents & STI
63,565
53,038
57,242
Accounts Receivable, Net
10,113
10,138
10,548
Inventories
10,399
11,000
12,015
Total Current Liabilities
54,109
62,224
64,293
Payables & Accruals
- -
- -
- -
ST Debt
31,010
37,445
26,988
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
22.32%
16.84%
2.49%
Free Cash Flow
117.7%
30.03%
-37.62%
Net Income, GAAP
53.47%
-5.45%
-25.74%
Sales/Revenue/Turnover
20.39%
2.27%
-3.24%
Total Cash Common Dividend
- -
- -
-39.88%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
15,087
15,326
15,870
16,343
62,626
2025
15,595
16,008
- -
14,502
60,598
2026
13,985
15,214
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
8.12
6.03
6.19
1
21.1
2025
3.05
3.53
- -
4.61
15.32
2026
3.97
7.91
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
8.02
- -
11.02
- -
18.75
2025
5.01
- -
- -
- -
11.02
2026
2
- -
- -
- -
- -

Company Description

CEO
Hsiu Lan Hsu
Full Time Employees
657
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Hsinchu Science Park Hsinchu TP Taiwan 30075
IPO Date
Oct 28, 2014
Business
GlobalWafers Co., Ltd. manufactures and sells semiconductor silicon ingots and wafers worldwide. The company produces silicon ingots; polished wafers; annealed wafers; epitaxial wafers; diffusion wafers; compound semiconductor wafers including silicon carbide and gallium nitride on silicon; SOI wafers; test wafers; and epitaxial products, with diameters ranging from 3 to 12 inches and supporting applications in logic, memory, power devices, RF, photonics, CMOS image sensors, 5G, electric vehicles, and advanced nodes up to 300mm. GlobalWafers operates manufacturing, R&D, and sales facilities in Taiwan, the United States, Europe, Japan, and Asia Pacific, serving leading chipmakers such as TSMC, Texas Instruments, and all of the top 25 semiconductor customers. Founded in 1981 and headquartered in Hsinchu City, Taiwan, the company spun off from Sino-American Silicon Products Inc. in 2011 and ranks as the world's third-largest silicon wafer supplier. Recent developments include receiving up to $406 million in preliminary U.S. CHIPS Act funding in December 2024 for 300mm wafer production expansion through subsidiaries GlobalWafers America and MEMC in Sherman, Texas, and St. Peters, Missouri; inaugurating a $3.5 billion wafer facility in Sherman in May 2025; and announcing collaboration with Apple to supply 300mm wafers from the Texas plant to meet rising U.S. demand.