Meiko Electronics Co., Ltd.

Meiko Electronics Co., Ltd.

108.00
EUR
-9.00
(-7.69%)
Nov 06Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
3,808.03
3,472.71
3,640.51
3,664.35
4,146.94
4,543.06
4,411.99
4,556.77
5,868.36
6,523.44
6,802.27
8,059.51
9,225.41
- -
Basic EPS, GAAP
1.11
-365.74
-429.81
67.51
167.07
257.62
98.8
177.29
444.21
345.02
428.7
581.61
758.59
- -
Free Cash Flow per Basic Share
-115.25
-151.91
286.2
317.15
75.23
-128.52
-95.9
-80.35
77.7
-132.24
63.64
-113.72
-862.01
- -
Dividend per Share
4.52
4.97
- -
6.69
33.43
24.95
34.96
15.02
40.27
52.26
65.57
94.31
104.77
- -
Book Value per Share
1,707.99
1,475.51
1,088.98
1,080.5
1,262.32
1,283.18
1,233.56
1,551.85
2,281.02
3,015.06
3,828.21
4,218.18
5,309.09
- -
Tangible Book Value per Share
1,690.64
1,464.31
1,080.88
1,072.13
1,254.3
1,272.91
1,201.96
1,516.25
2,243.82
2,742.13
3,577.97
3,996.2
5,113.16
- -
Basic Weighted Avg Shares
21
26
26
26
26
26
26
26
26
26
26
26
26
27
Sales/Revenue/Turnover
79,231
90,895
95,287
95,911
108,542
118,910
115,479
119,257
151,275
167,276
179,458
206,806
240,574
- -
Operating Margin (%)
1.16
-3.15
3.49
6.03
6.87
7.51
4.49
5.58
8.76
5.72
6.5
9.23
10.21
- -
Depreciation Expense
6,181
7,185
6,471
5,508
5,816
6,281
6,587
7,448
7,994
9,795
11,215
12,541
13,742
- -
Net Income, GAAP
23
-9,573
-11,250
1,767
4,373
6,743
2,586
4,640
11,451
8,847
11,310
14,924
19,782
- -
Effective Tax Rate (%)
98.98
- -
- -
34.46
10.26
14.23
21.96
8.34
9.32
17.68
17.72
18.59
27.21
- -
Profit Margin (%)
0.03
-10.53
-11.81
1.84
4.03
5.67
2.24
3.89
7.57
5.29
6.3
7.22
8.22
- -
Working Capital
5,830
4,428
13,339
9,396
7,445
8,089
7,652
7,156
5,340
18,233
21,125
13,855
14,234
- -
LT Debt
29,215
33,017
34,393
26,374
25,119
35,876
41,412
38,829
32,658
38,734
37,412
35,234
58,020
- -
Total Equity
44,705
38,620
28,763
28,538
33,040
33,586
32,480
40,608
58,684
84,473
105,457
115,605
143,805
- -
Return on Invested Capital (%)
0.01
- -
- -
4.48
8.15
8.72
4.21
5.84
10.19
5.47
5.53
7.97
7.54
- -
Return on Capital (%)
0.04
- -
- -
3.12
6.63
8.48
3.3
5.02
10.27
6.81
7.02
8.16
8.97
- -
Return on Common Equity (%)
0.06
-22.98
-33.52
6.22
14.26
20.24
7.85
12.76
23.16
13.03
12.89
14.46
16.18
- -

Capital Structure

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
ST Debt
64,234
63,886
- -
LT Borrowings
55,314
57,642
- -
LT Finance Leases
- -
378
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
26
26
26
Market Capitalization
- -
- -
- -

Working Capital

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
Total Current Assets
139,716
142,528
- -
Cash, Cash Equivalents & STI
38,708
27,505
- -
Accounts Receivable, Net
51,141
59,848
- -
Inventories
41,330
49,530
- -
Total Current Liabilities
118,784
128,294
- -
Payables & Accruals
- -
- -
- -
ST Debt
64,234
63,886
- -
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
18.57%
29.46%
24.39%
Free Cash Flow
-59.54%
-43.5%
670.36%
Net Income, GAAP
32.01%
43.28%
32.55%
Sales/Revenue/Turnover
10%
15.26%
16.33%
Total Cash Common Dividend
- -
55.02%
12.89%

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
206,806
2026
- -
- -
- -
- -
240,574
2027
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
581.61
2026
- -
- -
- -
- -
758.59
2027
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
94.31
2026
- -
- -
- -
- -
104.77
2027
- -
- -
- -
- -
- -

Company Description

CEO
Yuichiro Naya
Full Time Employees
14,332
Sector
Electronic technology
Industry
Electronic components
Address
5-14-15, Ogami Ayase Japan 252-1104
IPO Date
Dec 8, 2000
Business
Meiko Electronics Co., Ltd. manufactures and sells printed circuit boards and provides related electronic services. The company produces double-sided and multi-layer through-hole printed circuit boards (PCBs), high-density interconnect (HDI) PCBs, flexible printed circuit (FPC) boards, rigid-flex PCBs, high electric current PCBs, heat dissipation PCBs, embedded device PCBs, semiconductor package substrates, millimeter wave radar PCBs, metal base heat dissipation PCBs, copper inlay PCBs, any layer PCBs, mega thru hole substrates, liquid loop heat dissipation substrates, and FR4-FLEX/M-VIA Flex boards; it also offers solder stencils, PCB testers, imaging devices and systems, circuit design services, electronic manufacturing services (EMS) including component mounting and assembly, mounting jigs, metal masks, measurement substrate manufacturing and characteristic evaluation, package and board level co-design verification, high frequency measurement and simulation, one-stop services, video related equipment such as multi-vision systems, and mechatronics development and manufacturing. Meiko Electronics serves industries including automotive, telecommunications, industrial equipment, medical devices, consumer electronics, amusement, home appliances, smartphones, automated driving systems, solar power generation, AI servers, 5G infrastructure, advanced driver-assistance systems (ADAS), and the Internet of Things (IoT). Founded on November 25, 1975, and headquartered in Ayase-shi, Kanagawa, Japan, the company operates manufacturing facilities in Japan (Kanagawa, Fukushima, Yamagata, Miyagi), China (Guangzhou, Wuhan), Vietnam (multiple plants including Hoa Binh, Thang Long, Hai Duong), sales offices across Japan, China, Hong Kong, the United States, Europe, Thailand, Korea, and India, and maintains subsidiaries such as Yamagata Meiko Electronics Co., Ltd., Meiko Electronics (Vietnam) Co., Ltd., Meiko Electronics Hoa Binh Co., Ltd., Meiko Tech Co., Ltd., Meiko Electronic Development Co., Ltd., and Meiko Electronic Manufacturing Co., Ltd. Recent developments include the completion of Vietnam Plant #4 in April 2025 and the Hoa Binh Plant in July 2025 to expand PCB production capacity; an additional $15 million capital contribution to Meiko Electronics Hoa Binh Co., Ltd. in June 2024 to accelerate its Vietnam project; a September 2025 business alliance with Allied Circuit Co., Ltd. to enter the high-layer PCB market including AI servers, culminating in the establishment of joint venture Allied Circuit Meiko Vietnam Co., Ltd. in Phu Tho Province, Vietnam, with $16 million capital for high-layer PCB manufacturing and sales; a January 2024 equity funding round for Meiko Electronics Hoa Binh Co., Ltd.; name changes in April 2024 for Meiko Embedded Products Co., Ltd. to Meiko Electronic Development Co., Ltd. and related entities; and the holding of a 50th anniversary commemorative ceremony in November 2024.