1. Malaysia Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
Inari Amertron Berhad

Inari Amertron Berhad

MMYX:INARI
2.46
MYR
-0.12
(-4.65%)
67.38P/E
Nov 26Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
0.42
0.37
0.36
0.39
0.45
0.36
0.33
0.43
0.42
0.36
0.39
0.36
- -
0.31
Basic EPS, GAAP
0.05
0.06
0.05
0.08
0.08
0.06
0.05
0.1
0.11
0.09
0.08
0.06
- -
0.03
Free Cash Flow per Basic Share
- -
0.05
0.02
0.06
0.04
0.03
0.08
0.12
0.11
0.08
0.09
0.06
- -
0.06
Dividend per Share
0.01
0.02
0.03
0.03
0.06
0.07
0.04
0.07
0.12
0.09
0.08
0.06
- -
0.05
Book Value per Share
0.13
0.2
0.24
0.29
0.34
0.35
0.37
0.41
0.68
0.7
0.74
0.73
0.73
0.73
Tangible Book Value per Share
0.12
0.19
0.23
0.29
0.34
0.35
0.37
0.41
0.68
0.7
0.74
0.73
0.72
0.72
Basic Weighted Avg Shares
1,872
2,489
2,866
2,988
3,084
3,165
3,210
3,302
3,672
3,727
3,749
3,787
- -
3,801
Sales/Revenue/Turnover
794
933
1,043
1,177
1,376
1,153
1,057
1,429
1,548
1,354
1,479
1,352
1,187
1,187
Operating Margin (%)
14.16
16.89
15.18
20.67
19.17
18.05
15.39
24.21
27.35
22.41
16.01
13.99
8.2
8.32
Depreciation Expense
23
33
50
66
84
95
100
103
101
107
123
138
129
129
Net Income, GAAP
99
153
148
228
249
192
156
330
391
324
300
219
127
127
Effective Tax Rate (%)
6.11
1.13
3.94
5.13
11.96
11.03
9.24
6.11
12.31
8.64
3.22
3.26
10.88
10.88
Profit Margin (%)
12.5
16.35
14.21
19.36
18.11
16.63
14.73
23.13
25.25
23.89
20.3
16.18
10.74
10.74
Working Capital
182
399
387
559
684
646
731
897
2,031
2,107
2,396
2,358
2,384
2,384
LT Debt
19
26
19
25
15
9
3
1
14
15
16
14
14
14
Total Equity
259
535
681
873
1,071
1,122
1,209
1,377
2,511
2,606
3,174
3,090
3,100
3,100
Return on Invested Capital (%)
41.72
33.87
23.04
27.99
22.82
16.5
12.52
24.95
18.94
10.74
7.88
5.81
2.79
2.83
Return on Capital (%)
40.17
34.47
22.98
28.08
23.86
17.21
13.23
25.45
20.04
12.58
10.4
7.19
4.31
4.31
Return on Common Equity (%)
47.69
38.37
24.28
29.21
25.73
17.58
13.41
25.64
20.16
12.67
11.13
7.87
4.6
4.6

Capital Structure

MYR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
14
14
14
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
3,805
3,805
3,825
Market Capitalization
6,393
4,909
8,644

Working Capital

MYR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
Total Current Assets
2,649
2,619
2,699
Cash, Cash Equivalents & STI
2,180
2,176
2,214
Accounts Receivable, Net
235
212
250
Inventories
166
160
170
Total Current Liabilities
265
239
315
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

MYR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
18.29%
21.11%
0.31%
Free Cash Flow
47.06%
-8.42%
6.49%
Net Income, GAAP
5.84%
-15%
-41.71%
Sales/Revenue/Turnover
2.46%
-3.15%
-12.18%
Total Cash Common Dividend
17.92%
4.33%
-23.03%

Quarterly Revenue

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
384
414
348
333
1,479
2025
388
349
308
307
1,352
2026
326
307
266
289
1,187

Quarterly Earnings Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
0.02
0.02
0.01
0.08
2025
0.01
0.02
0.01
0.01
0.06
2026
0.01
0.01
0.01
- -
- -

Quarterly Dividends Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.02
0.02
0.02
0.08
2025
0.02
0.02
0.02
- -
0.06
2026
0.01
0.01
0.01
0.01
- -

Company Description

Company Profile APIChatGPT
CEO
Kean Cheong Lau
Full Time Employees
858
Sector
Electronic technology
Industry
Semiconductors
Address
D-07-03, Plaza Kelana Jaya Petaling Jaya SE Malaysia 47301
IPO Date
Jun 28, 2011
Website
inari-amertron.com
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Business
Inari Amertron Berhad, founded in 2010 and headquartered in Petaling Jaya, Malaysia, operates as a leading investment holding company providing outsourced semiconductor assembly and test (OSAT) services and electronics manufacturing services (EMS) to global customers in the semiconductor industry. The company offers comprehensive turnkey solutions including wafer probing and processing such as fine print wafer screen-printing bumping, SAC solder bump processing, pyramid core and pogo pin probe technologies, wafer thinning, plasma etching, and 2D/3D vision inspection; assembly services encompassing stencil printed SAC solder, dispensing of solder/glue/thermal materials, passive components down to 008004 size, LGA-SiP, FCBGA molded underfill, hermetic/leaded sensors/LED packages, system-on-module, fiber transceiver packages, and electromagnetic interference shielding at die/package/tester levels; package testing covering radio frequency up to 20GHz, fiber LIV/dynamic testing, optical/3D sensor testing, complex high-speed ASIC testing, and test design/development; as well as other services like new product introductions, failure analysis, customized automation and data processing systems via in-house iMES, customer tracking portals, full traceability/genealogy, burn-in/pre-cond/MSL packing, and vendor-managed inventory. Inari serves key market segments including smartphone/mobile devices, automotive, data communications, industrial, and generic applications, with manufacturing facilities in Malaysia, the Philippines, and China. In August 2025, Inari entered into a definitive joint acquisition agreement with China's San'an Optoelectronics to acquire 100% of Lumileds Holding B.V. and its European/Asian subsidiaries, a global LED technology leader, with the transaction expected to close by the first quarter of 2026 to support diversification into LED solutions and enhance growth prospects amid ongoing industry evolution.