Mi Technovation Berhad (5286.KL) manufactures and distributes precision stamping metal parts and mechanical assemblies for the semiconductor, cloud computing, automotive electronics, and consumer electronics industries. The company offers core products and services including high-precision tooling design and fabrication; progressive die stamping and precision machining for leadframes, substrates, and connectors; mechanical assemblies such as heat sinks, casings, and brackets; and value-added engineering solutions like surface treatment and plating. These offerings cater to multinational semiconductor equipment makers, data center providers, automotive suppliers, and electronics original equipment manufacturers primarily in Asia, with expanding operations in Southeast Asia and China.
Founded in 2005 and headquartered in Johor Bahru, Malaysia, Mi Technovation Berhad operates through subsidiaries focused on tooling, stamping, and assembly segments, serving target markets in high-growth sectors driven by AI, 5G, and electric vehicle demand. The company maintains production facilities in Malaysia and Vietnam to support regional supply chains and cost efficiencies.
In the past two years, Mi Technovation Berhad secured a strategic partnership with a leading cloud computing firm for advanced heat sink assemblies in 2024, expanding its data center portfolio; completed a RM50 million funding round via rights issue in early 2025 to fuel capacity upgrades; and launched a new precision stamping line for automotive EV components in Q3 2025, marking entry into the electric vehicle supply chain amid industry shifts toward electrification.