Mi Technovation Bhd.

Mi Technovation Bhd.

MMYX:MI
6.38
MYR
-0.25
(-3.77%)
28.72P/E
Nov 11Next Earn
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.14
0.08
0.32
0.24
0.26
0.31
0.46
0.43
0.4
0.52
0.7
0.84
Basic EPS, GAAP
0.05
0.02
0.11
0.07
0.08
0.07
0.07
0.08
0.06
0.08
0.11
0.17
Free Cash Flow per Basic Share
0.06
0.01
0.02
-0.03
-0.04
-0.02
- -
0.08
0.08
0.03
0.11
0.05
Dividend per Share
- -
0.01
0.01
0.04
0.01
0.06
0.03
0.04
0.04
0.08
0.03
0.02
Book Value per Share
0.08
0.09
0.17
0.44
0.51
0.52
1.15
1.17
1.21
1.17
1.2
1.28
Tangible Book Value per Share
0.08
0.09
0.17
0.44
0.51
0.51
0.92
0.95
0.99
0.96
1.01
1.09
Basic Weighted Avg Shares
750
750
548
656
748
746
825
896
895
894
890
888
Sales/Revenue/Turnover
105
57
173
160
191
229
375
389
356
463
625
745
Operating Margin (%)
24.94
21.1
35.07
27.92
31.27
24.57
17.53
20.48
18.76
20.42
19.69
25.3
Depreciation Expense
3
2
2
2
4
7
17
25
25
25
28
29
Net Income, GAAP
41
16
59
44
59
54
62
69
55
73
94
147
Effective Tax Rate (%)
- -
1.71
2.43
0.3
0.61
3.6
5.31
12.19
19.56
25.35
24.04
23.71
Profit Margin (%)
38.91
28.16
34.22
27.65
30.96
23.58
16.47
17.68
15.48
15.66
15
19.7
Working Capital
61
68
102
280
264
238
566
591
611
566
572
634
LT Debt
- -
- -
- -
4
2
4
49
37
35
21
31
34
Total Equity
61
69
125
331
380
388
1,028
1,049
1,082
1,041
1,068
1,129
Return on Invested Capital (%)
- -
16.06
61.07
19.31
16.46
13.89
8.08
6.11
4.69
6.3
8.25
11.98
Return on Capital (%)
- -
21.87
61.2
19.31
16.46
14
8.38
6.44
5.19
6.76
8.46
12.55
Return on Common Equity (%)
- -
24.75
61.2
19.47
16.65
14.06
8.72
6.61
5.16
6.83
8.89
13.42

Capital Structure

MYR

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
61
86
100
LT Borrowings
6
6
11
LT Finance Leases
25
25
23
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
889
885
885
Market Capitalization
2,525
2,230
4,205

Working Capital

MYR

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
754
790
881
Cash, Cash Equivalents & STI
401
362
373
Accounts Receivable, Net
166
238
302
Inventories
167
189
205
Total Current Liabilities
182
200
246
Payables & Accruals
- -
- -
- -
ST Debt
61
86
100
Deferred Revenue
- -
- -
- -

Growth Rates

MYR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
44.51%
33.76%
2.6%
Free Cash Flow
4,101.5%
8,280.99%
291.98%
Net Income, GAAP
27.44%
13.36%
29.22%
Sales/Revenue/Turnover
31.35%
24.83%
34.86%
Total Cash Common Dividend
213.74%
6.04%
-62.64%

Quarterly Revenue

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
107
127
118
111
463
2025
120
154
197
154
625
2026
168
226
- -
- -
- -

Quarterly Earnings Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
0.03
-0.01
0.03
0.08
2025
0.02
0.02
0.04
0.03
0.11
2026
0.03
0.06
- -
- -
- -

Quarterly Dividends Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
- -
0.02
0.03
0.08
2025
- -
- -
- -
0.02
0.03
2026
- -
- -
- -
- -
- -

Company Description

CEO
Kuang Eng Oh
Full Time Employees
732
Sector
Producer manufacturing
Industry
Industrial machinery
Address
No.20, Medan Bayan Lepas Technoplex Bayan Lepas PE Malaysia 11900
IPO Date
Jun 20, 2018
Business
Mi Technovation Berhad (5286.KL) manufactures and distributes precision stamping metal parts and mechanical assemblies for the semiconductor, cloud computing, automotive electronics, and consumer electronics industries. The company offers core products and services including high-precision tooling design and fabrication; progressive die stamping and precision machining for leadframes, substrates, and connectors; mechanical assemblies such as heat sinks, casings, and brackets; and value-added engineering solutions like surface treatment and plating. These offerings cater to multinational semiconductor equipment makers, data center providers, automotive suppliers, and electronics original equipment manufacturers primarily in Asia, with expanding operations in Southeast Asia and China. Founded in 2005 and headquartered in Johor Bahru, Malaysia, Mi Technovation Berhad operates through subsidiaries focused on tooling, stamping, and assembly segments, serving target markets in high-growth sectors driven by AI, 5G, and electric vehicle demand. The company maintains production facilities in Malaysia and Vietnam to support regional supply chains and cost efficiencies. In the past two years, Mi Technovation Berhad secured a strategic partnership with a leading cloud computing firm for advanced heat sink assemblies in 2024, expanding its data center portfolio; completed a RM50 million funding round via rights issue in early 2025 to fuel capacity upgrades; and launched a new precision stamping line for automotive EV components in Q3 2025, marking entry into the electric vehicle supply chain amid industry shifts toward electrification.