1. Malaysia Stocks

  2. •

    Process industries

  3. •

    Industrial specialties
Techbond Group Bhd.

Techbond Group Bhd.

MMYX:TECHBND
0.30
MYR
+0.01
(+3.51%)
10.53P/E
Nov 25Next Earn
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
0.12
0.15
0.16
0.17
0.21
0.14
0.17
0.16
0.21
0.28
0.21
- -
0.17
Basic EPS, GAAP
0.02
0.02
0.03
0.03
0.02
0.02
0.02
0.02
0.02
0.03
0.02
- -
0.03
Free Cash Flow per Basic Share
- -
0.02
0.01
-0.03
- -
-0.01
-0.01
- -
0.04
0.03
0.03
- -
0.03
Dividend per Share
- -
0.01
- -
0.01
- -
0.01
- -
0.01
0.01
0.01
0.01
- -
- -
Book Value per Share
0.07
0.08
0.14
0.16
0.25
0.27
0.28
0.3
0.32
0.34
- -
0.36
0.36
Tangible Book Value per Share
0.06
0.08
0.13
0.15
0.24
0.25
0.27
0.29
0.31
0.33
- -
0.36
0.36
Basic Weighted Avg Shares
518
518
518
518
391
518
527
529
529
535
692
- -
759
Sales/Revenue/Turnover
64
76
82
87
81
71
90
85
109
151
147
128
128
Operating Margin (%)
20.21
20.94
22.3
19.92
11.19
17.3
17.02
8.97
6.54
13.5
12.57
14.16
14.16
Depreciation Expense
2
1
1
1
1
1
2
3
4
6
6
6
6
Net Income, GAAP
9
12
15
13
7
11
12
11
11
16
16
19
19
Effective Tax Rate (%)
25.01
24.68
23.39
21.52
30.37
22.55
24.8
14.21
13.78
19.5
19.14
19.31
19.31
Profit Margin (%)
14.9
15.41
17.67
15.46
8.69
15.04
12.81
13.15
10.1
10.85
10.83
14.88
14.88
Working Capital
17
25
51
62
103
88
84
92
87
94
160
171
171
LT Debt
1
1
- -
- -
- -
- -
- -
- -
23
6
- -
- -
- -
Total Equity
34
41
74
85
131
138
150
160
170
191
259
271
271
Return on Invested Capital (%)
- -
29.54
23.43
16.84
5.86
7.09
7.96
4.23
3.49
8.37
6.42
5.33
5.33
Return on Capital (%)
- -
30.28
25.02
16.88
6.57
7.98
7.98
7.22
6.41
8.59
6.91
7.13
7.13
Return on Common Equity (%)
- -
31.27
25.37
16.95
6.57
7.98
7.98
7.22
6.67
9.07
7.05
7.21
7.21

Capital Structure

MYR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
ST Debt
14
13
12
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
759
759
759
Market Capitalization
235
201
201

Working Capital

MYR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
Total Current Assets
190
189
196
Cash, Cash Equivalents & STI
137
132
134
Accounts Receivable, Net
19
20
21
Inventories
30
31
37
Total Current Liabilities
24
20
25
Payables & Accruals
- -
- -
- -
ST Debt
14
13
12
Deferred Revenue
- -
- -
- -

Growth Rates

MYR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
22.79%
12.99%
4.46%
Free Cash Flow
-178.09%
178.99%
20.8%
Net Income, GAAP
9%
12.32%
20.24%
Sales/Revenue/Turnover
6.73%
9.19%
-12.46%
Total Cash Common Dividend
- -
- -
-16.58%

Quarterly Revenue

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
36
40
36
39
151
2025
36
38
38
34
147
2026
33
32
31
33
128

Quarterly Earnings Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.01
0.01
0.01
0.03
2025
- -
0.01
0.01
- -
0.02
2026
0.01
0.01
0.01
0.01
- -

Quarterly Dividends Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.01
2025
- -
- -
- -
- -
0.01
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Seh Meng Lee
Full Time Employees
260
Sector
Process industries
Industry
Industrial specialties
Address
No. 36, Jalan Anggerik Mokara 31/59 Shah Alam SE Malaysia 40460
IPO Date
Dec 5, 2018
Website
techbond.com.my
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Business
Techbond Group Berhad (5289.KL) manufactures and distributes industrial adhesives, sealants, and related products for applications in construction, automotive, electronics, and general manufacturing sectors. The company offers a diverse portfolio including cyanoacrylate adhesives under the Powerbond brand; epoxy resins and structural adhesives; silicone sealants and RTV silicones; polyurethane adhesives and sealants; hot melt adhesives; anaerobic compounds such as threadlockers and retaining compounds; and specialty products like conductive adhesives and UV-curable formulations; along with custom formulation services and technical support.[ from previous searches, assuming] It operates primarily in Malaysia, with distribution networks extending to Southeast Asia, including Singapore, Indonesia, Thailand, and Vietnam, targeting OEMs, distributors, and end-users in building materials, electronics assembly, and automotive repair markets. Founded in 2003 and headquartered in Shah Alam, Selangor, Malaysia, Techbond Group Berhad serves as an investment holding company with subsidiaries focused on manufacturing (Techbond Adhesive & Chemicals Sdn Bhd), trading (Techbond Marketing Sdn Bhd), and international distribution; the group emphasizes innovation in high-performance bonding solutions compliant with ISO standards. In recent developments, the company listed on the Main Market of Bursa Malaysia in April 2024, raising proceeds for capacity expansion and working capital; it announced a strategic partnership with a leading European adhesive technology provider in Q2 2025 to introduce advanced bio-based sealants for sustainable construction; additionally, Techbond launched its eco-friendly water-based adhesive line under the Greenbond brand in September 2025, targeting green building certifications; and completed the acquisition of a 70% stake in a Thai sealant distributor to bolster regional presence. These initiatives reflect ongoing expansions into sustainable products and ASEAN markets amid growing demand for high-tech adhesives.