VisDynamics Holdings Bhd.

VisDynamics Holdings Bhd.

MMYX:VIS
0.58
MYR
-0.04
(-6.50%)
Dec 18Next Earn
No data availableFinancial data will appear here once available

Capital Structure

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Quarterly Revenue

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Company Description

CEO
Ngee Hoe Choy
Full Time Employees
117
Sector
Electronic technology
Industry
Electronic equipment/Instruments
Address
Ayer Keroh Malaysia
IPO Date
Apr 17, 2006
Business
VisDynamics Holdings Berhad is a Malaysia-based investment holding company that specializes in the research, design, software development, assembly, and manufacturing of automated test equipment and backend handling solutions for the semiconductor and electronics packaging industries. Founded in 2003 and headquartered in Melaka, Malaysia, the company operates primarily through its wholly owned operating subsidiary, VisDynamics Research Sdn. Bhd., serving outsourced semiconductor assembly and test providers, integrated device manufacturers, and semiconductor packaging houses across Malaysia, China, Taiwan, the United States, Europe, and Southeast Asia. The company operates through two core business segments: Manufacturing and Others, which encompasses investment holding and corporate management services. VisDynamics Holdings Berhad provides a comprehensive suite of semiconductor machinery and precision inspection solutions, comprising tray-based automated handling and test systems such as the T6EVO platform series, including the T6EVO, T6EVO-2A, T6EVO-2T, T6EVO-3, T6EVO-5, and T6EVO-5T models designed for high-speed pick-and-place, multi-station test handling, and automated tape-and-reel processing; tube-based gravity-feed test handlers such as the G6L, G6-PLCC, and G6-LEVO systems configured for rapid device changeovers and multi-sided package inspection; bulk-and-tube high-speed turret handling systems such as the R20I series; specialized reel handling automation including the ARC-V30S and ARC-V30D automated reel changers; proprietary smart vision inspection platforms integrated with artificial intelligence algorithms for surface defect detection, 2D and 3D lead and ball coplanarity checks, package mark verification, and sub-micron positioning; custom factory automation equipment developed for specialized semiconductor manufacturing workflows; and comprehensive technical support, machinery retrofitting, preventive maintenance, calibration, and spare parts distribution services. In recent developments, VisDynamics Holdings Berhad has upgraded its product engineering roadmap by integrating artificial intelligence and deep-learning machine vision technologies into its backend inspection systems to address the exacting quality standards of advanced semiconductor packaging; enhanced the throughput efficiency and operational uptime of its flagship T6EVO and automated reel changer product lines; adjusted production and resource allocation to align with backend semiconductor cyclical trends and evolving supply chain demands; continued active corporate governance and shareholder capital returns through regular dividend distributions; and strengthened its regional sales and technical service networks to deepen engagement with leading outsourced semiconductor assembly and test customers across key Asian manufacturing hubs.