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    Electronic technology

  3. •

    Semiconductors
Montage Technology Co., Ltd. Class A

Montage Technology Co., Ltd. Class A

40.00
USD
+39.80
(+19,900.00%)
0.48EPS
Oct 29Next Earn
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.35
2.01
2.56
2.03
2
2.79
4.02
2.51
3.98
5.94
6.5
Basic EPS, GAAP
0.15
0.57
1.08
1.09
1.21
0.9
1.42
0.49
1.54
2.43
3.42
Free Cash Flow per Basic Share
0.61
0.28
1.39
0.99
0.62
0.57
0.51
0.34
1.44
1.91
- -
Dividend per Share
- -
- -
0.35
0.34
0.37
0.37
0.37
0.37
0.37
0.73
0.24
Book Value per Share
1.07
1.44
4.39
8.02
8.83
9.17
10.8
11.06
12.31
13.93
21.76
Tangible Book Value per Share
1.05
1.42
4.36
8
8.82
9.03
10.66
10.91
12.17
13.81
21.65
Basic Weighted Avg Shares
626
610
685
858
911
919
914
912
914
918
946
Sales/Revenue/Turnover
845
1,228
1,758
1,738
1,824
2,562
3,672
2,286
3,639
5,456
6,145
Operating Margin (%)
15.34
29.04
42.35
51.03
48.89
25.49
24.35
21.02
31.46
35.61
41.15
Depreciation Expense
13
17
20
30
31
59
50
103
124
132
- -
Net Income, GAAP
93
347
737
933
1,104
829
1,299
451
1,412
2,236
3,234
Effective Tax Rate (%)
6.35
4.26
6.28
4.69
8.38
9.38
8.1
4.46
5.09
8.23
7.47
Profit Margin (%)
10.98
28.26
41.92
53.68
60.52
32.36
35.38
19.73
38.8
40.97
52.63
Working Capital
858
1,158
3,660
7,399
6,413
6,986
7,997
7,905
8,781
10,264
18,813
LT Debt
- -
- -
- -
- -
15
20
9
2
29
19
122
Total Equity
883
1,187
3,616
7,330
8,069
8,391
9,927
10,207
11,397
12,871
21,437
Return on Invested Capital (%)
- -
33.16
30.2
16.95
14.2
9.98
13.99
4.43
12.32
17.38
18.35
Return on Capital (%)
- -
33.8
29.34
15.28
13.65
10.05
14.16
4.48
13.7
19.25
20.07
Return on Common Equity (%)
- -
33.52
30.69
17.05
14.33
10.07
14.2
4.49
13.08
18.38
19.32

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
15
17
21
LT Borrowings
- -
49
107
LT Finance Leases
19
18
15
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
928
989
989
Market Capitalization
- -
- -
- -

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
11,034
18,586
20,308
Cash, Cash Equivalents & STI
9,302
16,755
18,027
Accounts Receivable, Net
568
620
975
Inventories
896
982
996
Total Current Liabilities
770
754
1,495
Payables & Accruals
- -
- -
- -
ST Debt
15
17
21
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
9.94%
12.94%
Free Cash Flow
- -
61.81%
33.84%
Net Income, GAAP
- -
47.6%
58.35%
Sales/Revenue/Turnover
- -
31.04%
49.94%
Total Cash Common Dividend
- -
19.58%
98.11%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
737
928
906
1,068
3,639
2025
1,222
1,411
- -
1,399
5,456
2026
1,461
1,875
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.25
0.4
0.42
0.47
1.54
2025
0.57
0.68
- -
0.65
2.43
2026
0.9
1.16
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.37
2025
- -
- -
- -
0.24
0.73
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Chong He Yang
Full Time Employees
784
Sector
Electronic technology
Industry
Semiconductors
Address
Montage Circle Shanghai SH China 200233
IPO Date
Jul 22, 2019
Website
montage-tech.com
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Business
Montage Technology Co., Ltd. Montage Technology Co., Ltd. (688008.SS) is a China-based integrated circuit design company that provides high-performance, low-power IC solutions for cloud computing, artificial intelligence, and data center markets. Founded in 2004 and headquartered in Shanghai, the company principally offers interconnection chip products, including multiplexed rank registering clock driver (MRCD), multiplexed rank data buffer (MDB), registering clock driver (CKD), data buffer, clock driver, SPD EEPROM with hub, temperature sensor, power management IC, PCIe retimers, Memory eXpander Controller (MXC) as a Type 3 Compute Express Link DRAM memory controller, programmable clock generator chips, and data protection and trusted computing acceleration chips; as well as the Jindai (Jintide) Server Platform product line. Montage Technology operates globally with branches in Kunshan, Beijing, Xi'an, Macao, the United States, and South Korea, targeting server and client memory module manufacturers, cloud service providers, and data center operators primarily in the People's Republic of China and international markets. The company, a JEDEC board member pioneering DDR4 "1+9" distributed buffer architecture and DDR5 technologies, ranked as the world's largest memory interconnect chip supplier by 2024 revenue and among the top two global PCIe Retimer providers according to Frost & Sullivan. In 2025, Montage Technology advanced next-generation products such as PCIe 6.x Retimer and CXL 3.x MXC chips while earning repeat recognition on Forbes China's Top 50 Most Innovative Companies list for the second time since 2023.